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NTMT190N65S3HF

Onsemi

NTMT190N65S3HF by Onsemi

NTMT190N65S3HF by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 50A Max Pulsed Drain Current and 0.19 ohm Max Drain-Source Resistance. Operating in Enhancement Mode, it has a max power dissipation of 162W and can withstand temperatures from -55 to 150 °C.

Median Price

$6.336

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,950 parts In-Stock

1+ parts

$4.650

100+ parts

$2.780

1k+ parts

$2.180

10k+ parts

-

2,950

$4.650

$2.780

$2.180

-

DigiKey

USA . 2,935 parts In-Stock

1+ parts

$7.160

100+ parts

$3.623

1k+ parts

-

10k+ parts

$2.960

2,935

$7.160

$3.623

-

$2.960

Mouser Electronics

USA . 960 parts In-Stock

1+ parts

$7.160

100+ parts

$3.630

1k+ parts

$3.590

10k+ parts

$3.390

960

$7.160

$3.630

$3.590

$3.390

Element14

Singapore . 2,950 parts In-Stock

1+ parts

$7.660

100+ parts

$4.240

1k+ parts

-

10k+ parts

-

2,950

$7.660

$4.240

-

-

Newark

USA . 2,950 parts In-Stock

1+ parts

$8.400

100+ parts

$4.870

1k+ parts

$4.770

10k+ parts

-

2,950

$8.400

$4.870

$4.770

-

RS (Exports)

UK . 2,790 parts In-Stock

1+ parts

-

100+ parts

$5.512

1k+ parts

$4.977

10k+ parts

-

2,790

-

$5.512

$4.977

-

Rochester

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.490

1,350

-

$2.950

$2.640

$2.490

Verical

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

$3.888

1k+ parts

$3.300

10k+ parts

-

1,350

-

$3.888

$3.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,580 parts In-Stock

1+ parts

$3.126

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

$3.126

-

-

-

Vyrian

USA . 583 parts In-Stock

1+ parts

$3.290

100+ parts

-

1k+ parts

-

10k+ parts

-

583

$3.290

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,919 parts In-Stock

1+ parts

$2.961

100+ parts

-

1k+ parts

-

10k+ parts

-

1,919

$2.961

-

-

-

Corohmni

South Africa . 355 parts In-Stock

1+ parts

$3.290

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$3.290

-

-

-

Component Stockers USA

USA . 2,933 parts In-Stock

1+ parts

$6.200

100+ parts

$4.220

1k+ parts

$5.150

10k+ parts

-

2,933

$6.200

$4.220

$5.150

-

Microchip USA

USA . 5,311 parts In-Stock

1+ parts

$21.697

100+ parts

-

1k+ parts

-

10k+ parts

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5,311

$21.697

-

-

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SupplyDigital Components

Austria . 7,705 parts In-Stock

1+ parts

-

100+ parts

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7,705

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-

-

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Problanco Electronics

Mexico . 6,708 parts In-Stock

1+ parts

-

100+ parts

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6,708

-

-

-

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Kulean Microsystems

USA . 5,918 parts In-Stock

1+ parts

-

100+ parts

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5,918

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-

-

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TANS Electronics

Latvia . 3,071 parts In-Stock

1+ parts

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3,071

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UHIMA Technologies

Türkiye . 801 parts In-Stock

1+ parts

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801

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Perfect Parts

USA . 224 parts In-Stock

1+ parts

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224

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GreenTree Electronics

Israel . 100 parts In-Stock

1+ parts

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100+ parts

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100

-

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Overview

Experience superior performance and reliability with the NTMT190N65S3HF by Onsemi, a leader in semiconductor manufacturing. This N-CHANNEL Power FET is ideal for switching applications, offering a maximum DS Breakdown Voltage of 650V and a Maximum Drain Current of 20A. With a built-in diode, this transistor ensures efficient operation and enhanced protection. Whether you're designing industrial equipment or automotive systems, trust the NTMT190N65S3HF to deliver exceptional quality and durability. Upgrade your projects with this innovative solution from Onsemi and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

Allows for easier integration into circuits and better compatibility with other components.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring efficient operation and reliable performance.

Surface Mount: YES

Facilitates easy mounting on circuit boards, offering convenience during assembly.

Minimum DS Breakdown Voltage: 650 V

Provides a high breakdown voltage for enhanced protection against electrical overloads.

Package Shape: SQUARE

Offers a compact and space-saving design for efficient utilization in electronic devices.

Operating Mode: ENHANCEMENT MODE

Operates in enhancement mode, enabling better control and efficiency in the circuit.

Maximum Pulsed Drain Current (IDM): 50 A

Capable of handling high pulsing currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 220 mJ

Has a high avalanche energy rating, safeguarding the transistor from energy spikes and surges.

Maximum Drain Current (Abs) (ID): 20 A

Sustainable maximum drain current rating for stable and safe operation.

No. of Terminals: 5

Provides multiple connection points for versatile integration in various circuit configurations.

Maximum Power Dissipation (Abs): 162 W

Handles high power dissipation levels, ensuring efficient operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

Compact package style for efficient usage of space on circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for superior performance and reliability.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures without compromising performance.

Transistor Element Material: SILICON

High-quality silicon material for improved efficiency and longevity of the transistor.

Minimum Operating Temperature: -55 °C

Maintains functionality even in low-temperature environments, ensuring reliability in diverse conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Durable terminal finish for secure and reliable connections in the circuit.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance for efficient power transfer and minimal heat dissipation.

Terminal Position: DUAL

Dual terminal positioning for versatile connectivity options in circuit layouts.

Case Connection: DRAIN

Drain case connection for easy and efficient heat dissipation during operation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring durability during assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures for soldering without damage to the component.

Technical Specifications

Power Field Effect Transistors (FET) NTMT190N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMT190N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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