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NTMT125N65S3H

Onsemi

NTMT125N65S3H by Onsemi

NTMT125N65S3H by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 67A Max Pulsed Drain Current, 216mJ Avalanche Energy Rating, and 0.125 ohm Max Drain-Source Resistance. Operating in ENHANCEMENT MODE, it has a max power dissipation of 171W and can withstand temperatures from -55 to 150 °C.

Median Price

$3.900

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

$3.820

100+ parts

$3.010

1k+ parts

-

10k+ parts

-

3,000

$3.820

$3.010

-

-

Arrow

USA . 3,000 parts In-Stock

1+ parts

$4.892

100+ parts

$3.870

1k+ parts

$3.232

10k+ parts

$3.197

3,000

$4.892

$3.870

$3.232

$3.197

Mouser Electronics

USA . 6,000 parts In-Stock

1+ parts

$7.510

100+ parts

$4.540

1k+ parts

$3.560

10k+ parts

-

6,000

$7.510

$4.540

$3.560

-

Rochester

USA . 14,333 parts In-Stock

1+ parts

-

100+ parts

$3.120

1k+ parts

$2.790

10k+ parts

$2.620

14,333

-

$3.120

$2.790

$2.620

Verical

USA . 12,658 parts In-Stock

1+ parts

-

100+ parts

$3.900

1k+ parts

$3.487

10k+ parts

$3.275

12,658

-

$3.900

$3.487

$3.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,364 parts In-Stock

1+ parts

$3.287

100+ parts

-

1k+ parts

-

10k+ parts

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1,364

$3.287

-

-

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Vyrian

USA . 1,197 parts In-Stock

1+ parts

$3.460

100+ parts

-

1k+ parts

-

10k+ parts

-

1,197

$3.460

-

-

-

Bristol Electronics

USA . 2,975 parts In-Stock

1+ parts

$5.716

100+ parts

$2.477

1k+ parts

$2.344

10k+ parts

-

2,975

$5.716

$2.477

$2.344

-

Sensible Micro Corp

USA . 8,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,871

-

-

-

-

Flip Electronics

USA . 3,006 parts In-Stock

1+ parts

-

100+ parts

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3,006

-

-

-

-

Dan-Mar Components

USA . 2,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,975

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 489 parts In-Stock

1+ parts

$3.114

100+ parts

-

1k+ parts

-

10k+ parts

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489

$3.114

-

-

-

Corohmni

South Africa . 374 parts In-Stock

1+ parts

$3.460

100+ parts

-

1k+ parts

-

10k+ parts

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374

$3.460

-

-

-

Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

$6.410

100+ parts

$4.190

1k+ parts

$2.990

10k+ parts

-

3,000

$6.410

$4.190

$2.990

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Microchip USA

USA . 5,140 parts In-Stock

1+ parts

$22.848

100+ parts

-

1k+ parts

-

10k+ parts

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5,140

$22.848

-

-

-

SupplyDigital Components

Austria . 7,922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,922

-

-

-

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Problanco Electronics

Mexico . 7,641 parts In-Stock

1+ parts

-

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7,641

-

-

-

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TANS Electronics

Latvia . 7,252 parts In-Stock

1+ parts

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7,252

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-

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Kulean Microsystems

USA . 6,356 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,356

-

-

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UHIMA Technologies

Türkiye . 740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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740

-

-

-

-

Overview

Unlock the power of efficient switching with the NTMT125N65S3H by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unmatched reliability and performance in a variety of applications. From industrial machinery to consumer electronics, this transistor's single configuration with built-in diode ensures seamless operation. With a maximum operating temperature of 150 °C and a minimum breakdown voltage of 650V, this transistor delivers exceptional value and benefits to customers seeking quality components for their projects. Elevate your designs with the NTMT125N65S3H and experience the difference that Onsemi's expertise brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in applications requiring high efficiency and low power consumption.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and efficient performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications reliably.

Maximum Pulsed Drain Current (IDM): 67 A

The high pulsed drain current rating allows this FET to handle high current surges effectively.

Maximum Power Dissipation (Abs): 171 W

With a high power dissipation rating, this FET can handle significant power loads without overheating.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.125 ohm

Low on-resistance results in reduced power losses and improved efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NTMT125N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

67 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMT125N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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