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NTMFS5C670NT1G

Onsemi

NTMFS5C670NT1G by Onsemi

NTMFS5C670NT1G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, 440A IDM, and 0.007 ohm RDS(on). It is used in power management applications due to its high drain current capacity and low on-resistance. The transistor operates in enhancement mode with a max operating temperature of 175 °C.

Median Price

$0.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,389 parts In-Stock

1+ parts

$0.990

100+ parts

$0.405

1k+ parts

$0.271

10k+ parts

$0.228

1,389

$0.990

$0.405

$0.271

$0.228

DigiKey

USA . 875 parts In-Stock

1+ parts

$0.990

100+ parts

$0.405

1k+ parts

$0.312

10k+ parts

$0.219

875

$0.990

$0.405

$0.312

$0.219

Chip1Stop

Japan . 1,400 parts In-Stock

1+ parts

$3.050

100+ parts

$1.020

1k+ parts

$0.676

10k+ parts

-

1,400

$3.050

$1.020

$0.676

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 528 parts In-Stock

1+ parts

$2.898

100+ parts

-

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528

$2.898

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Flip Electronics

USA . 12,000 parts In-Stock

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12,000

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Vyrian

USA . 1,951 parts In-Stock

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1,951

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Distributors (Availability)

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Corohmni

South Africa . 353 parts In-Stock

1+ parts

$0.759

100+ parts

-

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-

10k+ parts

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353

$0.759

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Corphita

USA . 1,646 parts In-Stock

1+ parts

$2.745

100+ parts

-

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1,646

$2.745

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Microchip USA

USA . 104 parts In-Stock

1+ parts

$5.866

100+ parts

-

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104

$5.866

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AZTECH Wire

Italy . 152 parts In-Stock

1+ parts

$10.170

100+ parts

-

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152

$10.170

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SupplyDigital Components

Austria . 7,612 parts In-Stock

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7,612

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TANS Electronics

Latvia . 3,315 parts In-Stock

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3,315

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Problanco Electronics

Mexico . 2,977 parts In-Stock

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2,977

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Kulean Microsystems

USA . 571 parts In-Stock

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571

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UHIMA Technologies

Türkiye . 118 parts In-Stock

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118

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Overview

Unlock the power of innovation with the NTMFS5C670NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that provide unmatched performance and reliability. Ideal for a variety of applications, this N-CHANNEL FET offers enhanced efficiency and durability, making it the perfect choice for your next project. Experience the value and benefits of Onsemi's cutting-edge technology with the NTMFS5C670NT1G, where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications in power electronics.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher mobility and faster switching speeds compared to P-channel FETs, making them well-suited for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse voltage, enhancing the overall reliability of the product.

Surface Mount: YES

Surface-mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage rating ensures reliable operation under high voltage conditions, making this FET suitable for power applications.

Maximum Pulsed Drain Current (IDM): 440 A

The high pulsed drain current rating allows for handling of large transient currents, making this FET ideal for high-power applications.

Maximum Power Dissipation (Abs): 61 W

With a high power dissipation capability, this FET can handle high power levels without overheating, ensuring reliable performance.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for operation in harsh environmental conditions, increasing the versatility of the product.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C670NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

166 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

71 A

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

8.5 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

440 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5C670NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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