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NTMFS5C628NT1G

Onsemi

NTMFS5C628NT1G by Onsemi

NTMFS5C628NT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 900A IDM. Ideal for power applications, it features a built-in diode, 0.003 ohm RDS(on), and 565mJ EAS rating. Operating in enhancement mode, it can handle up to 150A ID making it suitable for high-power circuits.

Median Price

$1.082

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 962 parts In-Stock

1+ parts

$1.680

100+ parts

$0.713

1k+ parts

$0.562

10k+ parts

$0.413

962

$1.680

$0.713

$0.562

$0.413

Rochester

USA . 3,000 parts In-Stock

1+ parts

$1.880

100+ parts

$1.770

1k+ parts

$1.600

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-

3,000

$1.880

$1.770

$1.600

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Arrow

USA . 3,000 parts In-Stock

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$0.483

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$0.483

Verical

USA . 3,000 parts In-Stock

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$0.432

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$0.432

Distributors (In-Stock)

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Digiode

USA . 507 parts In-Stock

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$1.558

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507

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Vyrian

USA . 2,651 parts In-Stock

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Flip Electronics

USA . 1,500 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 310 parts In-Stock

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$1.476

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310

$1.476

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Corohmni

South Africa . 324 parts In-Stock

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$1.640

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324

$1.640

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Microchip USA

USA . 8,134 parts In-Stock

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$12.436

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$12.436

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QUARKTWIN TECHNOLOGY LTD

USA . 17,424 parts In-Stock

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TANS Electronics

Latvia . 6,399 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,064 parts In-Stock

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SupplyDigital Components

Austria . 1,535 parts In-Stock

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Kulean Microsystems

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Kepictronics

USA . 667 parts In-Stock

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UHIMA Technologies

Türkiye . 284 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

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Overview

Enhance the power efficiency and performance of your electronic devices with the NTMFS5C628NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power FETs that are ideal for a wide range of applications. With a built-in diode for added convenience, this N-CHANNEL transistor offers enhanced reliability and durability. Experience the benefits of increased power dissipation and superior operating temperatures, all in a compact and versatile package. Upgrade your electronics today with the NTMFS5C628NT1G for unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and longevity.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in one direction, making it suitable for various electronic applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode in the package, saving space and reducing component count.

Surface Mount: YES

Easily mounts onto PCBs, making assembly and maintenance convenient.

Minimum DS Breakdown Voltage: 60 V

Can withstand high voltages, providing reliability in demanding environments.

Maximum Pulsed Drain Current (IDM): 900 A

Capable of handling high current pulses, suitable for power applications.

Maximum Power Dissipation (Abs): 110 W

Can handle high power levels without overheating, ensuring stable performance.

Maximum Operating Temperature: 175 °C

Withstands high temperatures, making it suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.003 ohm

Low on-resistance minimizes power loss and heat generation, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C628NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

565 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

150 A

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5C628NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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