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NTMFS5C450NT1G

Onsemi

NTMFS5C450NT1G by Onsemi

NTMFS5C450NT1G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 102A ID, and 0.0033 ohm RDS(on). It's used in power applications due to its 800A IDM, 215mJ EAS rating, and -55 to 175°C operating temperature range.

Median Price

$1.405

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 1,500 parts In-Stock

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$0.940

100+ parts

$0.920

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$0.900

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$0.940

$0.920

$0.900

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DigiKey

USA . 3,631 parts In-Stock

1+ parts

$1.870

100+ parts

$1.306

1k+ parts

$1.013

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3,631

$1.870

$1.306

$1.013

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Distributors (In-Stock)

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Digiode

USA . 1,102 parts In-Stock

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$0.893

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$0.893

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Vyrian

USA . 1,216 parts In-Stock

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$0.940

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$0.940

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Ampacity Inc.

Singapore . 915 parts In-Stock

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$0.800

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915

$0.800

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Corphita

USA . 2,193 parts In-Stock

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$0.846

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Corohmni

South Africa . 252 parts In-Stock

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$0.940

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Microchip USA

USA . 4,244 parts In-Stock

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$8.991

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$8.991

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AZTECH Wire

Italy . 894 parts In-Stock

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$21.140

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SupplyDigital Components

Austria . 7,358 parts In-Stock

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Problanco Electronics

Mexico . 6,263 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

USA . 3,929 parts In-Stock

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TANS Electronics

Latvia . 3,503 parts In-Stock

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 500 parts In-Stock

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Overview

Unlock the power of innovation with the NTMFS5C450NT1G by Onsemi. This high-quality Power FET offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're looking to optimize power management in automotive systems or enhance efficiency in industrial machinery, this N-CHANNEL transistor with a built-in diode is designed to deliver exceptional results. Experience the value and benefits of Onsemi's advanced technology with the NTMFS5C450NT1G - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the power FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance compared to P-channel FETs, making them more efficient for power applications.

Maximum Pulsed Drain Current (IDM): 800 A

With a high maximum pulsed drain current, this power FET can handle peak load demands without overheating or failing.

Maximum Power Dissipation (Abs): 68 W

The high power dissipation rating allows the FET to efficiently handle high power levels without risk of overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance ensures that the FET can operate reliably in a wide range of environments.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C450NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

102 A

Maximum Drain Current (ID):

102 A

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

28 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

800 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5C450NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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