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NTMFS5834NLT1G

Onsemi

NTMFS5834NLT1G by Onsemi

NTMFS5834NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 276A pulsed drain current. Ideal for applications requiring high power dissipation in a small outline package, such as power supplies and motor control systems.

Median Price

$0.296

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$0.296

100+ parts

$0.278

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$0.251

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500

$0.296

$0.278

$0.251

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Distributors (In-Stock)

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Digiode

USA . 345 parts In-Stock

1+ parts

$0.268

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345

$0.268

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Vyrian

USA . 5,903 parts In-Stock

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Prism Electronics

USA . 1,567 parts In-Stock

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Corphita

USA . 213 parts In-Stock

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$0.254

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213

$0.254

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Corohmni

South Africa . 109 parts In-Stock

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$0.282

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109

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AZTECH Wire

Italy . 434 parts In-Stock

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$8.520

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434

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SupplyDigital Components

Austria . 7,388 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,018 parts In-Stock

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Kulean Microsystems

USA . 3,526 parts In-Stock

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Problanco Electronics

Mexico . 2,733 parts In-Stock

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TANS Electronics

Latvia . 2,363 parts In-Stock

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Perfect Parts

USA . 1,245 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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UHIMA Technologies

Türkiye . 1 parts In-Stock

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Overview

Experience the superior performance and reliability of the NTMFS5834NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) with a single configuration and built-in diode. Ideal for a wide range of applications, this N-channel transistor offers enhanced efficiency and power management. With a maximum pulsing drain current of 276 A and a minimum breakdown voltage of 40 V, this product ensures optimal functionality and durability. Invest in the NTMFS5834NLT1G for exceptional value and unmatched benefits in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and ensures the safety of the internal components.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and performance in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and can protect against reverse polarity.

Surface Mount: YES

Facilitates easy installation and saves space on the circuit board.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation within specified voltage limits.

Maximum Pulsed Drain Current (IDM): 276 A

Capable of handling high current spikes for demanding applications.

Avalanche Energy Rating (EAS): 48 mJ

Can withstand sudden voltage spikes without damage.

Maximum Power Dissipation (Abs): 107 W

Capable of dissipating heat effectively to prevent overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high switching speed and efficiency in power applications.

Maximum Operating Temperature: 150 °C

Allows operation in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.0136 ohm

Low on-resistance minimizes power loss and improves efficiency.

Case Connection: DRAIN

Simplifies the circuit layout and enhances the product's overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5834NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.0136 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

276 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5834NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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