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NTMFS5830NLT1G

Onsemi

NTMFS5830NLT1G by Onsemi

NTMFS5830NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 0.0036 ohm max RDS(on). It is used in applications requiring high power dissipation up to 125W, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 36,000 parts In-Stock

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Vyrian

USA . 9,668 parts In-Stock

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Digiode

USA . 716 parts In-Stock

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AZTECH Wire

Italy . 809 parts In-Stock

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Kulean Microsystems

USA . 6,969 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,399 parts In-Stock

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TANS Electronics

Latvia . 5,754 parts In-Stock

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Kepictronics

USA . 4,005 parts In-Stock

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Problanco Electronics

Mexico . 3,482 parts In-Stock

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RC Electronics

USA . 3,330 parts In-Stock

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Corphita

USA . 1,695 parts In-Stock

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SupplyDigital Components

Austria . 762 parts In-Stock

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UHIMA Technologies

Türkiye . 483 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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Overview

Unlock the power of innovation with the NTMFS5830NLT1G by Onsemi. This high-quality Power FET offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. From enhancing the efficiency of power supplies to optimizing motor control systems, this N-CHANNEL transistor delivers exceptional value and benefits to customers. Trust in the expertise of Onsemi and experience the advantages that this advanced technology has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making this product resistant to external factors.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL design offers efficient switching capabilities and low ON resistance, allowing for high performance in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves overall efficiency by reducing reverse recovery time and losses.

Surface Mount: YES

The surface mount capability enables easy and space-saving integration into circuit boards, ideal for compact and high-density designs.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET provides reliable protection against voltage spikes and surges, increasing the overall robustness of the system.

Maximum Pulsed Drain Current (IDM): 690 A

The high maximum pulsed drain current allows for handling of peak current demands, making this FET suitable for high-power applications with short duration pulses.

Maximum Power Dissipation (Abs): 125 W

With a maximum power dissipation of 125W, this FET can efficiently handle high-power operations while maintaining thermal stability and reliability.

Maximum Operating Temperature: 150 °C

Operating at up to 150 °C ensures reliable performance in harsh environments and high-temperature applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5830NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

361 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

172 A

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.0036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

690 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5830NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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