Loading...

NTMFS4C05NT3G

Onsemi

NTMFS4C05NT3G by Onsemi

NTMFS4C05NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 174A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.005 ohm RDS(on), and operates in the -55 to 150 °C temperature range.

Median Price

$1.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.480

10k+ parts

-

272

-

-

$1.480

-

Flip Electronics (Authorized)

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

272

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,000

-

-

-

-

Vyrian

USA . 4,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,811

-

-

-

-

Digiode

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,080

-

-

-

-

Flip Electronics

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 428 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$2.000

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

TANS Electronics

Latvia . 4,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,655

-

-

-

-

Kulean Microsystems

USA . 4,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,061

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,992

-

-

-

-

Problanco Electronics

Mexico . 2,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,949

-

-

-

-

SupplyDigital Components

Austria . 2,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,877

-

-

-

-

UHIMA Technologies

Türkiye . 788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

788

-

-

-

-

Corphita

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

640

-

-

-

-

Overview

Elevate your power systems with the NTMFS4C05NT3G by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors (FET). Designed for switching applications, this N-channel transistor offers unmatched performance and reliability. With a built-in diode, it simplifies circuit design and enhances efficiency. Whether you're looking to optimize power distribution or improve system functionality, this transistor is the ultimate solution. Trust Onsemi to provide cutting-edge technology that exceeds expectations. Experience the difference with the NTMFS4C05NT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and provides good insulation, making the transistor reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps with reverse voltage protection and can simplify circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such tasks.

Surface Mount: YES

Surface mount package allows for easy and convenient PCB assembly and saves space.

Minimum DS Breakdown Voltage: 30 V

High breakdown voltage ensures the transistor can handle a range of operating conditions without failure.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design that can be easily integrated into circuit layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor's conductivity, improving efficiency.

Maximum Pulsed Drain Current (IDM): 174 A

High pulsed drain current rating makes this transistor suitable for high-power, short-duration applications.

Avalanche Energy Rating (EAS): 84 mJ

Avalanche energy rating indicates the ability to withstand high-energy spikes, ensuring reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 21.7 A

High drain current rating allows the transistor to handle significant current loads without overheating.

No. of Terminals: 6

6 terminals offer flexibility in circuit connections and allow for various configurations.

Maximum Power Dissipation (Abs): 33 W

High power dissipation capability ensures the transistor can handle high-power applications without damage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for denser circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in switching applications.

Maximum Operating Temperature: 150 °C

High operating temperature rating ensures the transistor can operate reliably in various environments.

Transistor Element Material: SILICON

Silicon material provides good electrical properties and ensures reliability in the transistor's performance.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme conditions without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for reliable connections.

Maximum Drain Current (ID): 11.9 A

High drain current rating allows for reliable operation under heavy load conditions.

Maximum Drain-Source On Resistance: 0.005 ohm

Low on-resistance minimizes power losses and improves efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and layout.

Case Connection: DRAIN

Drain connection allows for easy integration into circuits and efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and reliable soldering during PCB assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures proper soldering of the transistor during assembly.

Maximum Feedback Capacitance (Crss): 59 pF

Low feedback capacitance minimizes signal distortion and improves switching speed in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4C05NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

21.7 A

Maximum Drain Current (ID):

11.9 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

59 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

174 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4C05NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20