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NTMFS4936NT1G

Onsemi

NTMFS4936NT1G by Onsemi

NTMFS4936NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 235A IDM. Ideal for SWITCHING applications, it features a built-in diode, 0.0055 ohm RDS(on), and 96.8mJ EAS rating. Operating in ENHANCEMENT MODE, this MOSFET has a max power dissipation of 43W and can handle up to 11.6A ID current.

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 443,321 parts In-Stock

1+ parts

-

100+ parts

$0.384

1k+ parts

$0.319

10k+ parts

$0.284

443,321

-

$0.384

$0.319

$0.284

Verical

USA . 366,997 parts In-Stock

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-

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$0.398

10k+ parts

$0.355

366,997

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$0.398

$0.355

RS (Exports)

UK . 110 parts In-Stock

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$0.357

110

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$0.357

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Digiode

USA . 2,397 parts In-Stock

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$0.299

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2,397

$0.299

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Cyclops Electronics Ltd

UK . 9,000 parts In-Stock

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Vyrian

USA . 7,167 parts In-Stock

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7,167

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Bristol Electronics

USA . 875 parts In-Stock

1+ parts

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$0.487

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$0.210

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875

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$0.487

$0.210

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Prism Electronics

USA . 310 parts In-Stock

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310

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DF Sales Co.

USA . 100 parts In-Stock

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100

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DF Sales Co.

USA . 100 parts In-Stock

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100

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A2Z Electronics, Inc.

USA . 95 parts In-Stock

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95

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Nova Conductors

Japan . 50 parts In-Stock

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50

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LWI Electronics Inc

India . 49 parts In-Stock

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49

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Ampacity Inc.

Singapore . 309,034 parts In-Stock

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$0.268

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309,034

$0.268

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Corphita

USA . 1,846 parts In-Stock

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$0.284

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$0.284

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Corohmni

South Africa . 321 parts In-Stock

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$0.315

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321

$0.315

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AZTECH Wire

Italy . 202 parts In-Stock

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$15.370

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$15.370

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Continental Prestige Electronics

USA . 441,321 parts In-Stock

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$0.289

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$0.289

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Lixinc

USA . 15,076 parts In-Stock

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Assy Fe

Spain . 7,015 parts In-Stock

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Problanco Electronics

Mexico . 4,720 parts In-Stock

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TANS Electronics

Latvia . 3,636 parts In-Stock

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SupplyDigital Components

Austria . 3,061 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Argo Parts USA

USA . 2,259 parts In-Stock

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ChipstoGo Electronic ltd

UK . 872 parts In-Stock

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Authorized Procurement Solutions

USA . 810 parts In-Stock

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GreenTree Electronics

Israel . 810 parts In-Stock

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UHIMA Technologies

Türkiye . 544 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 173 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Elevate your power management solutions with the NTMFS4936NT1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET offers unparalleled performance in switching applications. With a built-in diode and an impressive maximum drain current of 79A, this transistor is a game-changer in the industry. Whether you're looking for reliability, efficiency, or power, this device delivers it all. Upgrade your systems with Onsemi's cutting-edge technology and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used due to their high efficiency and fast switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse bias protection and simplifies circuit design.

Transistor Application: SWITCHING

Ideal for applications requiring high-speed switching such as power supplies and motor control.

Surface Mount: YES

Allows for easy integration onto circuit boards and saves space in the design.

Maximum Drain-Source On Resistance: 0.0055 ohm

Low on-resistance results in minimal power dissipation and high efficiency during operation.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, making it suitable for a wide range of environments.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4936NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

96.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

79 A

Maximum Drain Current (ID):

11.6 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

235 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4936NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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