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NTMFD5875NLT1G

Onsemi

NTMFD5875NLT1G by Onsemi

NTMFD5875NLT1G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 80A IDM. Ideal for applications requiring high power dissipation, such as motor control systems or power supplies. Features include 2 elements with built-in diode, small outline package style, and -55 to 175 °C operating temperature range.

Median Price

$0.868

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 10,500 parts In-Stock

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10,500

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Rochester

USA . 726 parts In-Stock

1+ parts

-

100+ parts

$0.868

1k+ parts

$0.721

10k+ parts

$0.642

726

-

$0.868

$0.721

$0.642

Distributors (In-Stock)

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Digiode

USA . 1,531 parts In-Stock

1+ parts

$0.676

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1,531

$0.676

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 3,001 parts In-Stock

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3,001

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Distributors (Availability)

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Corphita

USA . 1,386 parts In-Stock

1+ parts

$0.641

100+ parts

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1,386

$0.641

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Corohmni

South Africa . 409 parts In-Stock

1+ parts

$0.712

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409

$0.712

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AZTECH Wire

Italy . 532 parts In-Stock

1+ parts

$9.050

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532

$9.050

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Kulean Microsystems

USA . 6,782 parts In-Stock

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6,782

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TANS Electronics

Latvia . 6,651 parts In-Stock

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6,651

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Problanco Electronics

Mexico . 5,364 parts In-Stock

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5,364

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SupplyDigital Components

Austria . 3,558 parts In-Stock

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3,558

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UHIMA Technologies

Türkiye . 590 parts In-Stock

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590

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Overview

Unleash the power of innovation with the NTMFD5875NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are designed for efficiency and reliability. With a wide range of applications in power management systems, this N-CHANNEL transistor offers customers unparalleled performance and value. Experience enhanced functionality and seamless operation with the NTMFD5875NLT1G, providing you with the competitive edge you need to succeed in today's fast-paced technological landscape. Elevate your projects with Onsemi's superior products and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current carrying capabilities compared to P-channel FETs, making this product more efficient.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with a built-in diode allows for better control and protection in circuits where this FET is used.

Surface Mount: YES

Allows for easy and convenient integration onto PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage, this FET can handle higher voltages without damage, providing reliability in demanding applications.

Maximum Pulsed Drain Current (IDM): 80 A

Capable of handling high current pulses, making it suitable for power applications with sudden load changes.

Maximum Power Dissipation (Abs): 32 W

Can dissipate up to 32 W of power without overheating, making it reliable in high-power applications.

Maximum Drain-Source On Resistance: 0.045 ohm

Low drain-source on resistance leads to reduced power loss and improved efficiency in circuit operation.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD5875NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

36 pF

JESD-30 Code:

R-PDSO-F6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NTMFD5875NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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