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NTMFD4C20NT1G

Onsemi

NTMFD4C20NT1G by Onsemi

NTMFD4C20NT1G by Onsemi is an N-CHANNEL Power FET with 27.4A max drain current and 4.6W max power dissipation. Ideal for applications requiring high power handling in a compact form factor, such as power supplies and motor control systems. Operating temperature up to 150°C ensures reliable performance in demanding environments.

Median Price

$2.810

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

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$2.810

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3

$2.810

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Distributors (In-Stock)

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Nova Conductors

Japan . 17 parts In-Stock

1+ parts

$1.548

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17

$1.548

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DF Sales Co.

USA . 499 parts In-Stock

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$2.000

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499

$2.000

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DF Sales Co.

USA . 499 parts In-Stock

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$2.000

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499

$2.000

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Digiode

USA . 1,107 parts In-Stock

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$2.755

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1,107

$2.755

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Vyrian

USA . 7,424 parts In-Stock

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7,424

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Chip Stock

USA . 7,100 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 179 parts In-Stock

1+ parts

$0.837

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179

$0.837

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Continental Prestige Electronics

USA . 5,114 parts In-Stock

1+ parts

$1.271

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$1.246

5,114

$1.271

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$1.246

Argo Parts USA

USA . 763 parts In-Stock

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$1.271

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763

$1.271

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Corohmni

South Africa . 138 parts In-Stock

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$1.518

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138

$1.518

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.548

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$1.471

10k+ parts

$1.440

500

$1.548

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$1.471

$1.440

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$2.460

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3

$2.460

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Corphita

USA . 2,171 parts In-Stock

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$2.610

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$2.610

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AZTECH Wire

Italy . 398 parts In-Stock

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$16.630

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398

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Kepictronics

USA . 60,871 parts In-Stock

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Perfect Parts

USA . 7,116 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,678 parts In-Stock

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TANS Electronics

Latvia . 4,452 parts In-Stock

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SupplyDigital Components

Austria . 4,274 parts In-Stock

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Lixinc

USA . 3,411 parts In-Stock

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Assy Fe

Spain . 2,043 parts In-Stock

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Problanco Electronics

Mexico . 1,673 parts In-Stock

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Kulean Microsystems

USA . 1,423 parts In-Stock

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Futuretech Components

Singapore . 507 parts In-Stock

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507

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UHIMA Technologies

Türkiye . 216 parts In-Stock

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216

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Overview

Discover the power of the NTMFD4C20NT1G by Onsemi, a top-quality N-CHANNEL Power FET that delivers unparalleled performance in various applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this FET offers customers unmatched value with its high drain current and power dissipation capabilities. Ideal for use in power management systems, motor control, and other high-power applications, the NTMFD4C20NT1G ensures reliability and efficiency. Upgrade your projects with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically offer better performance and efficiency compared to P-CHANNEL FETs, making this product a good choice for various applications requiring high current handling.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and enabling efficient manufacturing processes.

Maximum Drain Current (Abs) (ID): 27.4 A

With a high maximum drain current rating, this FET can handle high power loads effectively, making it suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs): 4.6 W

The low power dissipation of this FET helps in reducing heat generation and energy loss, ensuring reliable and efficient operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and low gate current requirements, enhancing the performance and longevity of the FET in different applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, making it suitable for harsh environment applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good solderability and durability, ensuring secure connections and long-term reliability in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand peak reflow temperatures for a specified duration, facilitating smooth assembly processes without compromising its performance characteristics.

Peak Reflow Temperature °C: 260

The FET can endure high peak reflow temperatures, ensuring robust solder joints and reliable connections during the manufacturing and assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD4C20NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

27.4 A

Maximum Drain Current (ID):

27.4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFD4C20NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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