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NTLTD7900ZR2G

Onsemi

NTLTD7900ZR2G by Onsemi

NTLTD7900ZR2G by Onsemi is an N-CHANNEL FET with 2 elements, built-in diode and resistor. It has a max pulsed drain current of 30A and min DS breakdown voltage of 20V. Ideal for switching applications, this transistor operates in enhancement mode with a max power dissipation of 3.2W at a max temp of 150 °C.

Median Price

$0.364

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 297,816 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

297,816

-

$0.343

$0.285

$0.254

Verical

USA . 201,364 parts In-Stock

1+ parts

-

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$0.386

10k+ parts

$0.318

201,364

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-

$0.386

$0.318

Distributors (In-Stock)

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Digiode

USA . 2,486 parts In-Stock

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$0.268

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2,486

$0.268

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Vyrian

USA . 5,490 parts In-Stock

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5,490

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Connector Distribution Corp

USA . 3,000 parts In-Stock

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3,000

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Right Parts Inc.

USA . 3,000 parts In-Stock

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3,000

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Bristol Electronics

USA . 75 parts In-Stock

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75

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Corphita

USA . 488 parts In-Stock

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$0.254

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488

$0.254

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Corohmni

South Africa . 400 parts In-Stock

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$0.282

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400

$0.282

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AZTECH Wire

Italy . 598 parts In-Stock

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$18.300

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598

$18.300

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Continental Prestige Electronics

USA . 297,816 parts In-Stock

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$0.274

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TANS Electronics

Latvia . 7,819 parts In-Stock

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Problanco Electronics

Mexico . 7,319 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 2,702 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Kulean Microsystems

USA . 1,744 parts In-Stock

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UHIMA Technologies

Türkiye . 925 parts In-Stock

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925

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Overview

Unlock the power of cutting-edge technology with the NTLTD7900ZR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. Experience the benefits of enhanced performance and reliability with this N-CHANNEL transistor, featuring a common drain configuration and built-in diode and resistor elements. Whether you're looking to improve switching capabilities or increase efficiency, this product offers unrivaled value and versatility. Upgrade your projects today with the NTLTD7900ZR2G from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power electronics and offer high efficiency and fast switching speeds.

Minimum DS Breakdown Voltage: 20 V

This MOSFET can handle voltage up to 20V, making it suitable for a variety of low to medium voltage applications.

Maximum Pulsed Drain Current (IDM): 30 A

Capable of handling high current loads in short durations, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 3.2 W

With a high power dissipation rating, this FET can effectively dissipate heat generated during operation, ensuring reliability.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NTLTD7900ZR2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ESD PROTECTED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLTD7900ZR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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