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NTLTS3107PR2G

Onsemi

NTLTS3107PR2G by Onsemi

NTLTS3107PR2G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 8.3A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 3.3W at 150 °C.

Median Price

$0.846

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.846

1k+ parts

$0.702

10k+ parts

$0.626

3,000

-

$0.846

$0.702

$0.626

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.720

10k+ parts

$0.720

3,000

-

-

$0.720

$0.720

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.877

10k+ parts

-

3,000

-

-

$0.877

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,214 parts In-Stock

1+ parts

$0.558

100+ parts

-

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1,214

$0.558

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Digiode

USA . 2,247 parts In-Stock

1+ parts

$0.658

100+ parts

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2,247

$0.658

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 71 parts In-Stock

1+ parts

$0.558

100+ parts

-

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71

$0.558

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Corphita

USA . 2,194 parts In-Stock

1+ parts

$0.624

100+ parts

-

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2,194

$0.624

-

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Component Stockers USA

USA . 2,519 parts In-Stock

1+ parts

$0.710

100+ parts

$0.670

1k+ parts

$0.600

10k+ parts

-

2,519

$0.710

$0.670

$0.600

-

Microchip USA

USA . 419 parts In-Stock

1+ parts

$4.355

100+ parts

-

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419

$4.355

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Problanco Electronics

Mexico . 8,171 parts In-Stock

1+ parts

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8,171

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Kulean Microsystems

USA . 7,284 parts In-Stock

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7,284

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SupplyDigital Components

Austria . 7,059 parts In-Stock

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7,059

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A-Z Elektronik GmbH

Germany . 6,807 parts In-Stock

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6,807

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TANS Electronics

Latvia . 3,536 parts In-Stock

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3,536

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.558

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3,000

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$0.558

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UHIMA Technologies

Türkiye . 839 parts In-Stock

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839

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Overview

Discover the NTLTS3107PR2G by Onsemi, a high-quality P-Channel Power FET with built-in diode for efficient switching applications. Manufactured by Onsemi, this transistor offers reliable performance and durability. Ideal for a range of applications, this FET is designed to enhance operational efficiency and power management. With a maximum pulsing drain current of 25 A and a low on-resistance of 0.016 ohm, this transistor delivers superior performance and value. Upgrade your projects with the NTLTS3107PR2G and experience the benefits of advanced semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, which is ideal for applications where weight is a concern.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low resistance and high efficiency, making this product a good choice for applications requiring high performance.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage allows for reliable operation in applications where voltage spikes may occur, ensuring the safety and longevity of the product.

Maximum Pulsed Drain Current (IDM): 25 A

The high pulsed drain current rating means this FET can handle sudden spikes in current without failing, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.016 ohm

The low on-resistance results in minimal power loss and heat generation, making this FET an efficient choice for switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to operate reliably in high-temperature environments, ensuring consistent performance.

Technical Specifications

Power Field Effect Transistors (FET) NTLTS3107PR2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

8.3 A

Maximum Drain Current (ID):

5.9 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLTS3107PR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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