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NTLTD7900ZR2

Onsemi

NTLTD7900ZR2 by Onsemi

NTLTD7900ZR2 by Onsemi is an N-CHANNEL FET with 2 elements, built-in diode and resistor. It operates in enhancement mode for switching applications. With a max drain current of 6A, low on-resistance of 0.026 ohm, and peak reflow temperature of 235 °C, it's ideal for power management in various electronic devices.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37,000 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

37,000

-

$0.251

$0.208

$0.186

Verical

USA . 36,000 parts In-Stock

1+ parts

-

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$0.232

36,000

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-

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$0.232

Distributors (In-Stock)

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Vyrian

USA . 1,814 parts In-Stock

1+ parts

$0.163

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1,814

$0.163

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Digiode

USA . 239 parts In-Stock

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$0.196

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239

$0.196

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Cyclops Electronics Ltd

UK . 2,430 parts In-Stock

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Prism Electronics

USA . 13 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 174 parts In-Stock

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$0.163

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174

$0.163

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Corphita

USA . 222 parts In-Stock

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$0.185

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222

$0.185

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Continental Prestige Electronics

USA . 37,000 parts In-Stock

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$0.163

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37,000

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$0.163

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TANS Electronics

Latvia . 6,147 parts In-Stock

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Kulean Microsystems

USA . 5,536 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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SupplyDigital Components

Austria . 1,945 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Problanco Electronics

Mexico . 1,642 parts In-Stock

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Futuretech Components

Singapore . 507 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Perfect Parts

USA . 157 parts In-Stock

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Overview

Boost the performance of your electronic devices with the NTLTD7900ZR2 by Onsemi, a top-of-the-line Power Field Effect Transistor (FET) that offers unmatched quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is designed for SWITCHING applications, providing enhanced efficiency and power management. With a maximum Drain Current of 6A and Breakdown Voltage of 20V, this FET ensures optimal performance and durability. Say goodbye to power issues and hello to seamless functionality with the NTLTD7900ZR2 from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel power FETs generally have higher electron mobility and lower on-resistance, making them efficient for switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor provide added functionality and protection, making this power FET versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET can handle rapid transitions between on and off states efficiently.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this power FET can withstand higher voltages, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in compact spaces.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures precise control over the switching process, resulting in improved efficiency and performance.

Maximum Pulsed Drain Current (IDM): 30 A

With a high maximum pulsed drain current, this power FET can handle surge currents without compromising its performance.

Maximum Drain Current (Abs) (ID): 6 A

The maximum drain current of 6A allows for reliable operation under normal working conditions.

Maximum Power Dissipation (Abs): 3.2 W

The high maximum power dissipation ensures the power FET can operate efficiently without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides improved performance and reliability compared to other transistor technologies.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this power FET can withstand harsh operating conditions without degradation in performance.

Maximum Drain-Source On Resistance: 0.026 ohm

The low on-resistance minimizes power losses and improves efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) NTLTD7900ZR2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ESD PROTECTED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLTD7900ZR2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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