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NTJS3157NT4

Onsemi

NTJS3157NT4 by Onsemi

NTJS3157NT4 by Onsemi is a N-CHANNEL FET with 20V DS Breakdown Voltage, 3.2A Drain Current, and 0.06 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, it has a max power dissipation of 1W and can withstand temperatures up to 150 °C.

Median Price

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1k+

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Vyrian

USA . 6,684 parts In-Stock

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Digiode

USA . 1,539 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.474

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$2.449

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$2.350

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AZTECH Wire

Italy . 1,220 parts In-Stock

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$9.260

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Component Stockers USA

USA . 643 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 5,754 parts In-Stock

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Kulean Microsystems

USA . 3,159 parts In-Stock

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TANS Electronics

Latvia . 1,651 parts In-Stock

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Corphita

USA . 1,306 parts In-Stock

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SupplyDigital Components

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Corohmni

South Africa . 422 parts In-Stock

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UHIMA Technologies

Türkiye . 392 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NTJS3157NT4 from Onsemi. As a leading manufacturer in the industry, Onsemi offers top-quality Small Signal Field Effect Transistors (FET) that are perfect for switching applications. With a maximum drain current of 3.2 A and a low on-resistance of 0.06 ohm, this N-channel transistor delivers reliable operation and efficient power dissipation. The NTJS3157NT4 features a built-in diode and operates in enhancement mode, making it ideal for various electronic projects. Upgrade your designs with the NTJS3157NT4 and experience superior performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and reliable, providing good protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, making them efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection and allows for more versatile usage in various circuit configurations.

Transistor Application: SWITCHING

Designed for switching applications, offering fast response times and efficient performance.

Surface Mount: YES

Surface mount capability makes installation easier and allows for more compact circuit designs.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without failing.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards and ensures efficient use of space.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and makes soldering easier during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for enhanced performance and control over the transistor's conductivity.

Maximum Drain Current (Abs) (ID): 3.2 A

With a maximum drain current of 3.2A, this transistor can handle a variety of current loads effectively.

No. of Terminals: 6

Having 6 terminals allows for more versatile connections and configurations in circuits.

Maximum Power Dissipation (Abs): 1 W

The maximum power dissipation of 1W ensures the transistor can handle heat efficiently and operate reliably.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact designs and efficient use of space in circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides reliable and efficient performance in various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments without failing.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material, ensuring stable performance and durability.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, ensuring secure connections in circuits.

Maximum Drain-Source On Resistance: 0.06 ohm

With a low drain-source on resistance of 0.06 ohm, this transistor offers efficient current flow and minimal power loss.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connections in circuits.

Peak Reflow Temperature °C: 235

The peak reflow temperature of 235 °C ensures proper soldering and secure connections during manufacturing processes.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJS3157NT4 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJS3157NT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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