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NTJS3157NT2

Onsemi

NTJS3157NT2 by Onsemi

NTJS3157NT2 by Onsemi is a small signal N-channel FET with a min DS breakdown voltage of 20V. It is commonly used for switching applications due to its single configuration with built-in diode and max drain current of 3.2A.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 64,000 parts In-Stock

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64,000

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Vyrian

USA . 4,323 parts In-Stock

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4,323

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Digiode

USA . 1,229 parts In-Stock

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1,229

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Nova Conductors

Japan . 75 parts In-Stock

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75

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Aztec Data Supply Inc.

USA . 2,953 parts In-Stock

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$0.634

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2,953

$0.634

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AZTECH Wire

Italy . 590 parts In-Stock

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$18.194

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590

$18.194

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Ampacity Inc.

Singapore . 1,487 parts In-Stock

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$56.050

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1,487

$56.050

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Problanco Electronics

Mexico . 3,178 parts In-Stock

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Kulean Microsystems

USA . 2,992 parts In-Stock

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Continental Prestige Electronics

USA . 2,431 parts In-Stock

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Corphita

USA . 2,373 parts In-Stock

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2,373

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TANS Electronics

Latvia . 1,227 parts In-Stock

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SupplyDigital Components

Austria . 1,066 parts In-Stock

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UHIMA Technologies

Türkiye . 969 parts In-Stock

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Argo Parts USA

USA . 535 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Corohmni

South Africa . 315 parts In-Stock

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Overview

Discover the power of the NTJS3157NT2 by Onsemi, a small signal field effect transistor that brings quality and reliability to your applications. With its N-channel configuration and built-in diode, this transistor is perfect for switching operations. Its surface mount capability and gull wing terminals make installation a breeze. But what sets this product apart is its incredible value and benefits for customers like you. From its high maximum drain current of 3.2 A to its low drain-source resistance of only 0.06 ohm, this transistor delivers top-notch performance. And with a maximum operating temperature of 150 °C, it can handle even the toughest conditions. Trust in Onsemi's expertise and experience, and let the NTJS3157NT2 take your applications to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the components inside, making this product a reliable choice.

Polarity or Channel Type:

N-CHANNEL - The N-channel configuration allows for efficient signal amplification and low power consumption, making this product ideal for various applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and provides reverse voltage protection, offering added convenience and safety.

Transistor Application:

SWITCHING - Designed specifically for switching applications, this transistor ensures fast and efficient switching transitions, making it suitable for use in electronic devices such as power supplies or motor control.

Surface Mount:

YES - With surface mount capability, this product enables easy and convenient integration onto circuit boards, saving space and facilitating production processes.

Minimum DS Breakdown Voltage:

20 V - With a minimum breakdown voltage of 20 V, this transistor can handle higher voltage levels without failure, providing robust performance and reliability.

Package Shape:

RECTANGULAR - The rectangular package shape allows for efficient utilization of space when mounting onto circuit boards, making it suitable for compact designs.

Terminal Form:

GULL WING - The gull wing terminal form provides strong mechanical connections, ensuring secure and reliable soldering, thus enhancing the overall durability of the product.

Operating Mode:

ENHANCEMENT MODE - Operating in enhancement mode allows for precise control of the transistor's behavior, enabling efficient amplification and signal processing.

No. of Elements:

1 - With a single element, this transistor simplifies circuit design and reduces complexity, making it easier to integrate into various applications.

Maximum Drain Current (Abs) (ID):

3.2 A - With a maximum drain current of 3.2 A, this transistor can handle high current demands, making it suitable for power applications.

No. of Terminals:

6 - The six terminals provide multiple connection points, enhancing flexibility and enabling various circuit configurations.

Maximum Power Dissipation (Abs):

1 W - With a maximum power dissipation of 1 W, this transistor can effectively handle power without overheating, ensuring reliable operation.

Package Style (Meter):

SMALL OUTLINE - The small outline package style allows for easy integration into space-constrained designs, making it suitable for miniaturized electronic devices.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Implementing metal-oxide semiconductor technology ensures high-performance characteristics, including low power consumption and high switching speeds.

Maximum Operating Temperature:

150 °C - With a maximum operating temperature of 150°C, this transistor can withstand higher temperature environments, offering versatility and reliability.

Transistor Element Material:

SILICON - Made from silicon, this transistor delivers excellent electrical properties and reliability, making it a popular choice in a wide range of applications.

Terminal Finish:

TIN LEAD - The tin lead terminal finish provides excellent conductivity and solderability, ensuring reliable and durable connections during assembly.

Maximum Drain-Source On Resistance:

0.06 ohm - With a maximum drain-source on resistance of 0.06 ohm, this transistor offers low voltage drop, minimizing power losses and improving overall efficiency.

Terminal Position:

DUAL - Offering dual terminal position options, this transistor provides flexibility in circuit design and ensures compatibility with various PCB layouts.

Moisture Sensitivity Level (MSL):

1 - With an MSL rating of 1, this transistor is highly resistant to moisture, ensuring stability and longevity even in humid environments.

Peak Reflow Temperature °C:

235 - With a peak reflow temperature of 235°C, this transistor can withstand high-temperature soldering processes, facilitating efficient manufacturing.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJS3157NT2 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJS3157NT2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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