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NTJS4405NT4G

Onsemi

NTJS4405NT4G by Onsemi

NTJS4405NT4G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a SINGLE configuration with BUILT-IN DIODE and 0.35 ohm Drain-Source On Resistance. This SMALL OUTLINE transistor has 6 terminals, operates in ENHANCEMENT MODE, and offers a max Drain Current of 1A.

Median Price

$0.153

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 808,462 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

808,462

-

$0.159

$0.132

$0.117

Verical

USA . 808,462 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.147

808,462

-

-

-

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,884 parts In-Stock

1+ parts

$0.124

100+ parts

-

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1,884

$0.124

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Cyclops Electronics Ltd

UK . 4,725 parts In-Stock

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4,725

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Vyrian

USA . 3,321 parts In-Stock

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3,321

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 879 parts In-Stock

1+ parts

$0.117

100+ parts

-

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879

$0.117

-

-

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Corohmni

South Africa . 89 parts In-Stock

1+ parts

$0.130

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89

$0.130

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$18.700

100+ parts

-

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524

$18.700

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Continental Prestige Electronics

USA . 845,819 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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$0.119

845,819

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$0.119

Authorized Procurement Solutions

USA . 150,000 parts In-Stock

1+ parts

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150,000

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Metaverse IC Inc.

Canada . 55,000 parts In-Stock

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55,000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,020 parts In-Stock

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10,020

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TANS Electronics

Latvia . 6,960 parts In-Stock

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6,960

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SupplyDigital Components

Austria . 6,584 parts In-Stock

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6,584

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A-Z Elektronik GmbH

Germany . 5,762 parts In-Stock

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5,762

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Kepictronics

USA . 5,225 parts In-Stock

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5,225

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Kulean Microsystems

USA . 4,096 parts In-Stock

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4,096

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Problanco Electronics

Mexico . 2,785 parts In-Stock

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2,785

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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180

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Overview

Upgrade your electronic devices with the NTJS4405NT4G by Onsemi, a high-quality N-CHANNEL Small Signal Field Effect Transistor. Manufactured by the reputable Onsemi brand, this transistor is perfect for switching applications and comes in a convenient surface-mount package. With a built-in diode and low drain-source on resistance, this transistor offers exceptional value and performance to customers looking for reliable and efficient components. Enhance your electronics with the NTJS4405NT4G and experience the difference in quality and reliability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the transistor, making it suitable for various environments.

Minimum DS Breakdown Voltage: 25 V

With a breakdown voltage of 25V, this transistor can handle higher voltages without failure, ensuring reliable performance.

Maximum Drain Current (ID): 1 A

This transistor can handle a maximum drain current of 1A, making it suitable for applications that require high current switching.

Maximum Drain-Source On Resistance: 0.35 ohm

The low on-resistance of 0.35 ohm results in minimal power dissipation and improved efficiency in switching applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and low power consumption, making this transistor an efficient choice.

Transistor Element Material: SILICON

Silicon material ensures reliability and stability in performance, making this transistor a long-lasting solution.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJS4405NT4G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

.35 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJS4405NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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