Loading...

NTDV20N06T4G

Onsemi

NTDV20N06T4G by Onsemi

NTDV20N06T4G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 20A Drain Current, and 0.046 ohm On Resistance. Ideal for switching applications, it features N-CHANNEL polarity, GULL WING terminals, and ENHANCEMENT MODE operation. Suitable for surface mount with a max power dissipation of 60W at 175°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

DigiKey Marketplace

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Vyrian

USA . 2,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,196

-

-

-

-

Digiode

USA . 807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

807

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,011 parts In-Stock

1+ parts

$2.580

100+ parts

-

1k+ parts

-

10k+ parts

-

2,011

$2.580

-

-

-

Corohmni

South Africa . 166 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$3.040

-

-

-

Microchip USA

USA . 450 parts In-Stock

1+ parts

$19.760

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$19.760

-

-

-

SupplyDigital Components

Austria . 6,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,052

-

-

-

-

TANS Electronics

Latvia . 5,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,297

-

-

-

-

Argo Parts USA

USA . 4,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,091

-

-

-

-

Continental Prestige Electronics

USA . 4,044 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,044

-

-

-

-

Problanco Electronics

Mexico . 2,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,820

-

-

-

-

Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Corphita

USA . 648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

648

-

-

-

-

Kulean Microsystems

USA . 589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

589

-

-

-

-

UHIMA Technologies

Türkiye . 219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

219

-

-

-

-

Overview

Enhance your electronic devices with the NTDV20N06T4G by Onsemi! Manufactured to the highest quality standards, this power FET offers unmatched reliability and performance. Ideal for switching applications, this N-channel transistor with a built-in diode is designed for enhanced mode operation, ensuring seamless functionality. With a maximum drain current of 20A and a minimum DS breakdown voltage of 60V, this transistor delivers exceptional power dissipation and energy efficiency. Upgrade your projects today with the NTDV20N06T4G and experience the superior value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the N-channel configuration, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the switching performance of the transistor, providing a reliable and efficient operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high performance and efficiency in controlling power flow.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages, making it ideal for various power applications.

Maximum Pulsed Drain Current (IDM): 60 A

Capable of handling high current pulses, suitable for applications requiring quick power bursts.

Avalanche Energy Rating (EAS): 170 mJ

Provides good protection against avalanche breakdown, ensuring reliability under high energy conditions.

Maximum Power Dissipation (Abs): 60 W

Can dissipate heat efficiently, preventing overheating and ensuring stable operation even under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for enhanced performance and efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTDV20N06T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

120 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

60 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

140 ns

Maximum Turn On Time (ton):

140 ns

Trade Compliance

NTDV20N06T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 8