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NTDV20N06T4G-VF01

Onsemi

NTDV20N06T4G-VF01 by Onsemi

NTDV20N06T4G-VF01 by Onsemi is a Power FET with 60V DS Breakdown Voltage, 20A Drain Current, and 0.046 ohm On Resistance. Ideal for switching applications in automotive electronics due to its AEC-Q101 standard compliance and high power dissipation of 60W.

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Vyrian

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Digiode

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Microchip USA

USA . 2,104 parts In-Stock

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AZTECH Wire

Italy . 970 parts In-Stock

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Kulean Microsystems

USA . 8,206 parts In-Stock

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TANS Electronics

Latvia . 7,833 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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Corphita

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UHIMA Technologies

Türkiye . 417 parts In-Stock

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Overview

Experience superior performance and reliability with the NTDV20N06T4G-VF01 power field effect transistor from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and innovation. This N-channel FET is ideal for switching applications, offering enhanced efficiency and power management. With a maximum pulsated drain current of 60 A and a minimum DS breakdown voltage of 60 V, this transistor ensures optimal performance under various conditions. Trust Onsemi for cutting-edge technology and unbeatable value in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good physical protection and insulation for the internal components of the FET, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer lower ON-resistance and better performance compared to P-CHANNEL FETs, making them suitable for high power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling in inductive loads, improving the overall performance and reducing the risk of voltage spikes in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and reliable operation in control circuits with minimal power loss.

Maximum Power Dissipation (Abs) 60 W

With a high power dissipation rating of 60W, this FET can handle moderate to high power levels without overheating, ensuring long-term operation and stability.

Maximum Operating Temperature 175 °C

Operating up to 175 °C allows for use in high-temperature environments without sacrificing performance, making it suitable for a wide range of industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTDV20N06T4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

120 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

60 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

140 ns

Maximum Turn On Time (ton):

140 ns

Trade Compliance

NTDV20N06T4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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