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NTDV20P06LT4G-VF01

Onsemi

NTDV20P06LT4G-VF01 by Onsemi

NTDV20P06LT4G-VF01 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 50A and EAS of 304mJ, operating in ENHANCEMENT MODE with -55 to 175 °C temperature range. The transistor has 0.15 ohm RDS(on), DRAIN case connection, and AEC-Q101 compliance.

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AZTECH Wire

Italy . 1,154 parts In-Stock

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Overview

Discover the NTDV20P06LT4G-VF01 by Onsemi, a top-quality P-Channel Power FET perfect for switching applications. With a robust design and built-in diode, this transistor offers reliable performance and efficient power management. Whether you're looking to optimize energy consumption or enhance circuit efficiency, this product delivers unparalleled value and benefits. Trust Onsemi's expertise in semiconductor technology and unlock new possibilities with the NTDV20P06LT4G-VF01.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body offers good durability and reliability for the FET, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration allows for efficient switching operations in electronic circuits, enhancing the overall performance of the FET.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET is capable of handling high voltage levels, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 50 A

The high pulsed drain current rating of 50A allows for reliable operation under heavy load conditions, ensuring the FET can handle peak power requirements.

Maximum Drain Current (Abs) (ID): 15.5 A

The maximum drain current rating of 15.5A ensures a consistent and stable flow of current in the FET, making it suitable for high-performance applications.

Maximum Power Dissipation (Abs): 65 W

The high power dissipation rating of 65W indicates that the FET can effectively dissipate heat generated during operation, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The maximum operating temperature of 175 °C allows the FET to function reliably in high-temperature environments, making it suitable for industrial applications.

Maximum Turn Off Time (toff): 185 ns

The fast turn-off time of 185ns ensures rapid switching operations, improving the overall efficiency and performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NTDV20P06LT4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

304 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15.5 A

Maximum Drain Current (ID):

15.5 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

120 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

185 ns

Maximum Turn On Time (ton):

200 ns

Trade Compliance

NTDV20P06LT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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