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NTD95N02R-001G

Onsemi

NTD95N02R-001G by Onsemi

NTD95N02R-001G by Onsemi is a Power FET with 32A ID, 0.005 ohm RDS(on), and 24V DS breakdown voltage. Ideal for switching applications due to its N-channel configuration and built-in diode. Operates in enhancement mode with a max temp of 150 °C, making it suitable for various power management tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,066 parts In-Stock

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Vyrian

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Problanco Electronics

Mexico . 6,087 parts In-Stock

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TANS Electronics

Latvia . 5,105 parts In-Stock

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Kulean Microsystems

USA . 2,912 parts In-Stock

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Corphita

USA . 1,839 parts In-Stock

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SupplyDigital Components

Austria . 1,811 parts In-Stock

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UHIMA Technologies

Türkiye . 380 parts In-Stock

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Corohmni

South Africa . 342 parts In-Stock

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Overview

Discover the power of the NTD95N02R-001G by Onsemi, a high-quality Power FET that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL transistor is perfect for switching applications. With a maximum drain current of 32A and a low on-resistance of 0.005 ohm, this transistor provides superior efficiency and power handling capabilities. Whether you're designing power supplies, motor controls, or lighting systems, the NTD95N02R-001G delivers the performance and value you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and faster switching speeds compared to P-channel FETs, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling of inductive loads, reducing voltage spikes and protecting the FET from damage in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it suitable for use in power management circuits.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24 V, this FET can handle higher voltages without breakdown, ensuring reliable operation in various voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in circuit boards, making it convenient for use in compact electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure physical connection to the circuit board, reducing the risk of solder joint failure and ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low ON-resistance, making this FET efficient and suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand higher temperatures without performance degradation, making it reliable in harsh operating environments.

Transistor Element Material: SILICON

Silicon-based FETs provide high performance, reliability, and cost-effectiveness, making them a popular choice for various electronic devices and applications.

Maximum Drain Current (ID): 32 A

With a maximum drain current of 32 A, this FET can handle high current loads without overheating, ensuring efficient power management and reliable operation.

Maximum Drain-Source On Resistance: 0.005 ohm

The low ON-resistance of 0.005 ohm minimizes power loss and heat dissipation in the FET, resulting in higher efficiency and improved performance in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD95N02R-001G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD95N02R-001G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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