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NTD95N02R-001

Onsemi

NTD95N02R-001 by Onsemi

NTD95N02R-001 by Onsemi is a Power FET with 32A ID, 0.005ohm RDS(on), and 24V DS breakdown voltage. Ideal for switching applications, it features an N-channel configuration in a plastic/epoxy package with built-in diode. Operating in enhancement mode, this MOSFET has a drain case connection and 84mJ EAS rating.

Median Price

$0.195

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,725 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

13,725

-

$0.211

$0.175

$0.156

DigiKey

USA . 13,725 parts In-Stock

1+ parts

-

100+ parts

-

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$0.180

13,725

-

-

-

$0.180

Verical

USA . 13,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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$0.195

13,725

-

-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,354 parts In-Stock

1+ parts

$0.164

100+ parts

-

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2,354

$0.164

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Vyrian

USA . 1,878 parts In-Stock

1+ parts

$0.173

100+ parts

-

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1,878

$0.173

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,382 parts In-Stock

1+ parts

$0.156

100+ parts

-

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-

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2,382

$0.156

-

-

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Corohmni

South Africa . 355 parts In-Stock

1+ parts

$0.173

100+ parts

-

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355

$0.173

-

-

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Continental Prestige Electronics

USA . 13,725 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.159

10k+ parts

-

13,725

-

-

$0.159

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SupplyDigital Components

Austria . 5,931 parts In-Stock

1+ parts

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5,931

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Kulean Microsystems

USA . 5,905 parts In-Stock

1+ parts

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5,905

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Problanco Electronics

Mexico . 5,649 parts In-Stock

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5,649

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TANS Electronics

Latvia . 1,135 parts In-Stock

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1,135

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UHIMA Technologies

Türkiye . 796 parts In-Stock

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796

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Overview

Unleash the power of innovation with the NTD95N02R-001 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor is designed to elevate performance and efficiency in switching applications. With a minimum DS Breakdown Voltage of 24V and a maximum Drain Current of 32A, this N-CHANNEL FET offers unparalleled reliability and durability. Experience seamless operation and enhanced functionality with its built-in diode configuration. Trust Onsemi for top-notch quality and unmatched value. Elevate your projects to new heights with the NTD95N02R-001.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this FET lightweight and durable, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer lower on-resistance and higher current carrying capability, making this FET a good choice for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET allows for more efficient switching and protection against reverse current flow, making it ideal for applications where diode protection is required.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and high efficiency, making it ideal for power management in various electronic devices.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24V, this FET can safely handle higher voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of space on a circuit board, making installation and integration into the system simple.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET provides high performance and reliability, ensuring stable operation over extended periods of time.

Maximum Drain Current (ID): 32 A

With a maximum drain current of 32A, this FET can handle high current loads, making it suitable for power applications that require high current capabilities.

Maximum Drain-Source On Resistance: 0.005 ohm

The low on-resistance of 0.005 ohm ensures minimal power loss and efficient performance, making this FET ideal for high power applications where low resistance is critical.

Technical Specifications

Power Field Effect Transistors (FET) NTD95N02R-001 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD95N02R-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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