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NTD95N02RT4

Onsemi

NTD95N02RT4 by Onsemi

NTD95N02RT4 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 32A ID, and 0.005 ohm RDS(on). The transistor operates in ENHANCEMENT MODE and has an EAS of 84mJ, making it ideal for high-power switching circuits.

Median Price

$0.292

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

15,000

-

$0.304

$0.252

$0.225

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.281

15,000

-

-

-

$0.281

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,277 parts In-Stock

1+ parts

$0.237

100+ parts

-

1k+ parts

-

10k+ parts

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2,277

$0.237

-

-

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Vyrian

USA . 7,810 parts In-Stock

1+ parts

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7,810

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,808 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

-

10k+ parts

-

1,808

$0.224

-

-

-

Corohmni

South Africa . 336 parts In-Stock

1+ parts

$0.249

100+ parts

-

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-

10k+ parts

-

336

$0.249

-

-

-

AZTECH Wire

Italy . 310 parts In-Stock

1+ parts

$21.160

100+ parts

-

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310

$21.160

-

-

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

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100+ parts

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20,000

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Continental Prestige Electronics

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.229

10k+ parts

-

15,000

-

-

$0.229

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Kulean Microsystems

USA . 7,938 parts In-Stock

1+ parts

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7,938

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SupplyDigital Components

Austria . 5,185 parts In-Stock

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5,185

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Problanco Electronics

Mexico . 4,609 parts In-Stock

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4,609

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TANS Electronics

Latvia . 1,074 parts In-Stock

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1,074

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UHIMA Technologies

Türkiye . 706 parts In-Stock

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706

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Overview

Unleash the power of cutting-edge technology with the NTD95N02RT4 from Onsemi. As a leader in the industry, Onsemi has crafted a high-quality Power Field Effect Transistor that exceeds expectations. Ideal for switching applications, this N-CHANNEL transistor offers unmatched performance and reliability. With a built-in diode and low on-resistance, it delivers outstanding efficiency and precision. Take your projects to the next level with the NTD95N02RT4 and experience the difference that superior quality and advanced technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics and are commonly used in switching applications, making this product a good choice for efficient operation.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better efficiency and protection in switching applications, making this product a reliable choice for robust performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is optimized for fast and efficient switching operations, making it ideal for various electronic circuits.

Surface Mount: YES

Being surface mountable means easy and convenient installation on circuit boards, saving space and labor during assembly.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24V, this transistor can handle higher voltage levels, ensuring reliable performance in diverse applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and mounting on circuit boards, enhancing the overall design flexibility of the product.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, ensuring reliable electrical connections during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency in operation, making this product a solid choice for demanding applications.

Avalanche Energy Rating (EAS): 84 mJ

With a high avalanche energy rating of 84mJ, this transistor can withstand large energy spikes, ensuring durability and protection in harsh operating conditions.

No. of Terminals: 2

Having only 2 terminals simplifies the connection and integration of the transistor into electronic circuits, making it user-friendly and easy to work with.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs, making this transistor suitable for applications where size is a critical factor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability in electronic circuits, making this product a dependable choice for various applications.

Transistor Element Material: SILICON

Silicon transistors offer superior electrical properties and durability, making this product a reliable choice for long-term performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides corrosion resistance and ensures stable electrical connections, contributing to the reliability and longevity of the product.

Maximum Drain Current (ID): 32 A

With a high maximum drain current of 32A, this transistor can handle high power loads, making it suitable for demanding applications that require robust performance.

Maximum Drain-Source On Resistance: 0.005 ohm

The low drain-source on resistance of 0.005 ohm reduces power losses and improves efficiency in switching applications, making this product a high-performance choice.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection of the transistor, making it user-friendly and easy to integrate into electronic circuits.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and thermal management, ensuring reliable operation and longevity of the transistor.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures reliable soldering and thermal stability during assembly, making this product suitable for reflow soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) NTD95N02RT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD95N02RT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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