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NTD95N02R

Onsemi

NTD95N02R by Onsemi

NTD95N02R by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 24V DS Breakdown Voltage, 32A ID, and 0.005 ohm Drain-Source Resistance. This MOSFET in GULL WING package style is designed for ENHANCEMENT MODE operation in various electronic circuits.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,744 parts In-Stock

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Digiode

USA . 2,159 parts In-Stock

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AZTECH Wire

Italy . 127 parts In-Stock

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$9.540

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Problanco Electronics

Mexico . 5,267 parts In-Stock

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TANS Electronics

Latvia . 4,478 parts In-Stock

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Corphita

USA . 1,335 parts In-Stock

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Kulean Microsystems

USA . 1,076 parts In-Stock

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UHIMA Technologies

Türkiye . 971 parts In-Stock

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SupplyDigital Components

Austria . 607 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NTD95N02R by Onsemi. As a leader in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for switching applications. This N-CHANNEL transistor offers a single configuration with a built-in diode, providing enhanced performance and efficiency. With a minimum DS Breakdown Voltage of 24V and a maximum Drain Current of 32A, this transistor is designed to meet your needs. Experience seamless operation and unmatched reliability with the NTD95N02R - the ultimate solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protects the circuit from reverse voltage spikes.

Transistor Application: SWITCHING

Ideal for applications where fast and efficient switching is required, such as power supplies and motor control circuits.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 24 V

With a high breakdown voltage, the FET can handle higher voltages without breakdown, improving the reliability of the circuit.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing electronic systems and PCB layouts.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, reducing the risk of solder joint failures.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have high input impedance and are easily controlled by voltage, making them versatile for various applications.

Avalanche Energy Rating (EAS): 84 mJ

High avalanche energy rating ensures the FET can withstand high-energy transients without damage, improving the overall robustness of the circuit.

No. of Terminals: 2

Simple two-terminal configuration simplifies circuit design and reduces complexity in the system.

Package Style (Meter): SMALL OUTLINE

Compact small outline package allows for high component density on the PCB and efficient use of board space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, reliability, and efficiency for power FET applications.

Transistor Element Material: SILICON

Silicon-based FETs provide high gain, low ON-resistance, and high breakdown voltage, making them suitable for power applications.

Terminal Finish: TIN LEAD

Tin lead terminals provide good solderability, ensuring reliable and durable connections in the circuit.

Maximum Drain Current (ID): 32 A

High maximum drain current rating allows the FET to handle high current loads, suitable for power applications.

Maximum Drain-Source On Resistance: 0.005 ohm

Low ON-resistance minimizes power losses and improves efficiency in power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and layout, making it easier to integrate the FET into the system.

Case Connection: DRAIN

Drain connection allows for efficient heat dissipation and improved thermal performance of the FET.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures reliable solder joints during the assembly process, improving the overall quality and durability of the product.

Technical Specifications

Power Field Effect Transistors (FET) NTD95N02R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD95N02R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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