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NTD4815N-1G

Onsemi

NTD4815N-1G by Onsemi

NTD4815N-1G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 87A IDM, and 0.025 ohm RDS(on). Ideal for SWITCHING applications, it features an N-CHANNEL configuration with a built-in DIODE. This METAL-OXIDE SEMICONDUCTOR device has a SILICON element and operates in ENHANCEMENT MODE.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 910 parts In-Stock

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-

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$0.290

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$0.241

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$0.215

910

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$0.290

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$0.215

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Digiode

USA . 1,582 parts In-Stock

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$0.226

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$0.226

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Vyrian

USA . 3,459 parts In-Stock

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3,459

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Corphita

USA . 2,129 parts In-Stock

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$0.214

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$0.214

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Corohmni

South Africa . 151 parts In-Stock

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$0.238

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AZTECH Wire

Italy . 1,098 parts In-Stock

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$15.230

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$15.230

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,204 parts In-Stock

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SupplyDigital Components

Austria . 6,173 parts In-Stock

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Kulean Microsystems

USA . 5,306 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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TANS Electronics

Latvia . 1,636 parts In-Stock

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UHIMA Technologies

Türkiye . 791 parts In-Stock

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Problanco Electronics

Mexico . 488 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the power and efficiency of the NTD4815N-1G by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors (FET). This N-CHANNEL transistor with a built-in diode is ideal for switching applications, offering a reliable and durable solution for your electronic devices. With a low drain-source on resistance and maximum pulsed drain current of 87 A, this transistor provides exceptional performance and energy efficiency. Upgrade your products with the NTD4815N-1G and experience the superior quality and value that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities and low on-resistance for better performance.

Minimum DS Breakdown Voltage: 30 V

Ensures reliability and protection against voltage spikes in circuit applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers added functionality with the built-in diode.

Maximum Pulsed Drain Current (IDM): 87 A

Provides high current handling capacity for demanding applications.

Avalanche Energy Rating (EAS): 60.5 mJ

Ensures robustness and protection against avalanche breakdown events.

Transistor Application: SWITCHING

Ideal for switching applications due to its high current capabilities and fast switching speed.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency, low power consumption, and reliable performance.

Maximum Drain-Source On Resistance: 0.025 ohm

Provides low on-resistance for reduced power dissipation and improved efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTD4815N-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

6.9 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

87 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4815N-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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