Loading...

NTD4809N-35G

Onsemi

NTD4809N-35G by Onsemi

NTD4809N-35G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 130A IDM, and 0.014 ohm RDS(on). Ideal for SWITCHING applications, it features an N-CHANNEL configuration in PLASTIC/EPOXY package with built-in DIODE. Operating at up to 175 °C, this MOSFET has a peak reflow temp of 260°C and EAS of 91mJ.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 61,875 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

61,875

-

$0.251

$0.208

$0.186

Farnell

UK . 61,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.238

61,875

-

-

-

$0.238

Verical

USA . 58,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.232

58,725

-

-

-

$0.232

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 460 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

-

460

$0.196

-

-

-

Vyrian

USA . 2,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,974

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,406 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$0.185

-

-

-

Corohmni

South Africa . 106 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

106

$0.206

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.025

100+ parts

$0.933

1k+ parts

$0.840

10k+ parts

-

3,000

$1.025

$0.933

$0.840

-

AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$19.030

100+ parts

-

1k+ parts

-

10k+ parts

-

590

$19.030

-

-

-

Problanco Electronics

Mexico . 7,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,522

-

-

-

-

Perfect Parts

USA . 6,055 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,055

-

-

-

-

TANS Electronics

Latvia . 5,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,424

-

-

-

-

Kulean Microsystems

USA . 2,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,827

-

-

-

-

GreenTree Electronics

Israel . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

-

-

-

-

Assy Fe

Spain . 1,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,735

-

-

-

-

SupplyDigital Components

Austria . 1,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 1,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

-

-

-

-

UHIMA Technologies

Türkiye . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

Overview

Enhance your power switching applications with the NTD4809N-35G by Onsemi. This high-quality Power FET offers reliable performance and efficiency, thanks to its N-channel configuration and built-in diode. Perfect for a range of uses, from industrial machinery to automotive systems, this transistor provides exceptional value and benefits. Trust in Onsemi's expertise to deliver top-notch products that meet your needs. Experience the advantages of the NTD4809N-35G and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product ideal for portable or mobile applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-state resistance and higher conductivity, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this transistor can handle higher voltages without getting damaged, providing reliability in operation.

Maximum Pulsed Drain Current (IDM): 130 A

The high pulsed drain current rating of 130A allows the transistor to handle sudden surges in current, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this transistor can operate efficiently in high-temperature environments without overheating.

Maximum Drain-Source On Resistance: 0.014 ohm

The low on-resistance of 0.014 ohms minimizes power loss and heat generation, making the transistor energy-efficient and suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4809N-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

91 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

130 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4809N-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20