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NTD4805N-1G

Onsemi

NTD4805N-1G by Onsemi

NTD4805N-1G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 175A IDM, and 0.0074 ohm RDS(on). Ideal for SWITCHING applications, it features an ENHANCEMENT MODE operation and 79W Pdiss. The N-CHANNEL transistor has a SILICON element and operates at up to 175 °C.

Median Price

$17.630

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip1Stop

Japan . 5 parts In-Stock

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Digiode

USA . 1,998 parts In-Stock

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$16.748

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Vyrian

USA . 2,389 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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Bristol Electronics

USA . 600 parts In-Stock

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Dan-Mar Components

USA . 600 parts In-Stock

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Benley Electronics

USA . 45 parts In-Stock

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$0.300

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AZTECH Wire

Italy . 1,200 parts In-Stock

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$9.290

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Corphita

USA . 1,233 parts In-Stock

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Corohmni

South Africa . 308 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 8,101 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,286 parts In-Stock

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Problanco Electronics

Mexico . 4,286 parts In-Stock

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TANS Electronics

Latvia . 3,961 parts In-Stock

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Kulean Microsystems

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GreenTree Electronics

Israel . 525 parts In-Stock

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UHIMA Technologies

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Perfect Parts

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Overview

Power up your projects with the NTD4805N-1G from Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and reliability. This N-channel transistor with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a maximum pulsed drain current of 175 A and a minimum DS breakdown voltage of 30 V, this transistor is designed to meet your power needs with ease. Trust Onsemi for high-quality components that deliver value and superior performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring reliable operation in various conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-state resistance and higher efficiency compared to P-channel FETs.

Transistor Application: SWITCHING

Designed for efficient switching applications, making it suitable for power control and energy management.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage applications without risk of damage.

Maximum Pulsed Drain Current (IDM): 175 A

Capable of handling high current pulses, making it suitable for applications requiring high power output.

Maximum Power Dissipation (Abs): 79 W

High power dissipation rating allows the FET to handle power loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides efficient switching performance and low on-state resistance for improved power management.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments, ensuring reliability under varying thermal conditions.

Maximum Drain-Source On Resistance: 0.0074 ohm

Low on-resistance minimizes power losses and improves efficiency in power switching applications.

Case Connection: DRAIN

The case connection at the drain terminal simplifies circuit design and layout for easier integration.

Technical Specifications

Power Field Effect Transistors (FET) NTD4805N-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

288 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

95 A

Maximum Drain Current (ID):

12.6 A

Maximum Drain-Source On Resistance:

.0074 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4805N-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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