Loading...

NTD4804N-1G

Onsemi

NTD4804N-1G by Onsemi

NTD4804N-1G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 230A IDM, and 0.0055 ohm RDS(on). Ideal for SWITCHING applications, it features an ENHANCEMENT MODE operation and 175 °C Max Temp. With a built-in diode, this N-CHANNEL transistor has a max power dissipation of 93.75W in a RECTANGULAR package.

Median Price

$0.595

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$0.595

1k+ parts

$0.493

10k+ parts

$0.440

70

-

$0.595

$0.493

$0.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 245 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$0.463

-

-

-

Vyrian

USA . 4,821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,821

-

-

-

-

PC Components Company LLC

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48

-

-

-

-

Bristol Electronics

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,678 parts In-Stock

1+ parts

$0.438

100+ parts

-

1k+ parts

-

10k+ parts

-

1,678

$0.438

-

-

-

Corohmni

South Africa . 405 parts In-Stock

1+ parts

$0.487

100+ parts

-

1k+ parts

-

10k+ parts

-

405

$0.487

-

-

-

AZTECH Wire

Italy . 1,086 parts In-Stock

1+ parts

$17.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,086

$17.900

-

-

-

Kepictronics

USA . 10,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,100

-

-

-

-

Authorized Procurement Solutions

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,500

-

-

-

-

SupplyDigital Components

Austria . 6,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,380

-

-

-

-

Problanco Electronics

Mexico . 2,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,221

-

-

-

-

TANS Electronics

Latvia . 1,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,551

-

-

-

-

UHIMA Technologies

Türkiye . 855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

855

-

-

-

-

GreenTree Electronics

Israel . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

Kulean Microsystems

USA . 42 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42

-

-

-

-

Overview

Upgrade your power management system with the NTD4804N-1G by Onsemi. This high-quality Power FET offers reliable performance for switching applications, thanks to its N-CHANNEL polarity and SINGLE configuration with a built-in diode. With a maximum drain current of 14.5 A and low on-resistance of 0.0055 ohm, this transistor delivers efficient power handling. Trust Onsemi's expertise in semiconductor technology to bring you a product that ensures optimal power dissipation and operating temperature, making it a valuable addition to your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring long-term reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs offer high efficiency and fast switching speeds, making them suitable for a wide range of applications including power supplies and motor control.

Transistor Application: SWITCHING

Specifically designed for switching applications, offering efficient and rapid control over power flow in circuits.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, providing a greater margin of safety in high-power applications.

Maximum Power Dissipation (Abs): 93.75 W

Capable of dissipating high amounts of power, allowing for reliable operation under heavy loads without overheating.

Maximum Drain-Source On Resistance: 0.0055 ohm

Low on-resistance results in minimal voltage drops across the transistor, reducing power losses and improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTD4804N-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

450 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

117 A

Maximum Drain Current (ID):

14.5 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

230 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4804N-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20