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NTD3813N-1G

Onsemi

NTD3813N-1G by Onsemi

NTD3813N-1G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 16V DS Breakdown Voltage, 114A Pulsed Drain Current, and 0.0145 ohm Drain-Source Resistance. This METAL-OXIDE SEMICONDUCTOR device operates in ENHANCEMENT MODE and has a max power dissipation of 34.9W at 175 °C.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,100 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

11,100

-

$0.251

$0.208

$0.186

Verical

USA . 11,100 parts In-Stock

1+ parts

-

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$0.232

11,100

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$0.232

Distributors (In-Stock)

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Digiode

USA . 1,179 parts In-Stock

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$0.196

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$0.196

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Vyrian

USA . 8,242 parts In-Stock

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8,242

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Distributors (Availability)

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Corphita

USA . 1,975 parts In-Stock

1+ parts

$0.185

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$0.185

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Corohmni

South Africa . 338 parts In-Stock

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$0.206

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338

$0.206

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AZTECH Wire

Italy . 1,011 parts In-Stock

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$14.020

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1,011

$14.020

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Continental Prestige Electronics

USA . 11,100 parts In-Stock

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$0.189

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11,100

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$0.189

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Kepictronics

USA . 9,100 parts In-Stock

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SupplyDigital Components

Austria . 4,774 parts In-Stock

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Problanco Electronics

Mexico . 1,731 parts In-Stock

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1,731

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Kulean Microsystems

USA . 1,059 parts In-Stock

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1,059

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UHIMA Technologies

Türkiye . 508 parts In-Stock

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508

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TANS Electronics

Latvia . 469 parts In-Stock

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469

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Overview

Unlock the power of the NTD3813N-1G by Onsemi, a top-tier manufacturer known for delivering quality products in the Power Field Effect Transistors category. This single N-channel transistor with a built-in diode is designed for switching applications, offering customers enhanced performance and reliability. With a maximum drain current of 51 A and a low on-resistance of 0.0145 ohm, this transistor provides exceptional value and benefits to users seeking high efficiency and optimal functionality. Trust Onsemi to provide cutting-edge technology that meets your power requirements with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient conduction of currents in the N-type channel, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Saves space and simplifies circuit designs by integrating a diode within the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Enables easy installation and soldering onto PCBs, saving time and effort in assembly processes.

Minimum DS Breakdown Voltage: 16 V

Withstands high voltages, making it suitable for applications requiring voltage regulation or protection.

Maximum Pulsed Drain Current (IDM): 114 A

Capable of handling high current pulses, ideal for applications requiring transient current loads.

Maximum Power Dissipation (Abs): 34.9 W

Efficiently dissipates power, minimizing the risk of overheating and ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degradation, suitable for demanding industrial environments.

Maximum Drain-Source On Resistance: 0.0145 ohm

Low on-resistance leads to minimal power loss and efficient performance in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD3813N-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

15 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

16 V

Maximum Drain Current (Abs) (ID):

51 A

Maximum Drain Current (ID):

9.6 A

Maximum Drain-Source On Resistance:

.0145 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

114 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD3813N-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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