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NTD24N06-1G

Onsemi

NTD24N06-1G by Onsemi

NTD24N06-1G by Onsemi is a single N-channel power FET with 24A max drain current and 62.5W max power dissipation. Ideal for applications requiring high-power switching in enhancement mode operation, such as motor control and power supplies. Operating at up to 175°C, it features metal-oxide semiconductor technology and surface-mount capability for efficient performance.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,148 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

3,148

-

$0.225

$0.186

$0.166

Verical

USA . 3,148 parts In-Stock

1+ parts

-

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$0.208

3,148

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$0.208

Distributors (In-Stock)

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Digiode

USA . 841 parts In-Stock

1+ parts

$0.175

100+ parts

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841

$0.175

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Vyrian

USA . 3,327 parts In-Stock

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3,327

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Distributors (Availability)

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Corphita

USA . 1,067 parts In-Stock

1+ parts

$0.166

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1,067

$0.166

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Corohmni

South Africa . 85 parts In-Stock

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$0.184

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85

$0.184

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Microchip USA

USA . 214 parts In-Stock

1+ parts

$1.240

100+ parts

$1.230

1k+ parts

$1.220

10k+ parts

$1.220

214

$1.240

$1.230

$1.220

$1.220

AZTECH Wire

Italy . 977 parts In-Stock

1+ parts

$14.370

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977

$14.370

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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SupplyDigital Components

Austria . 7,973 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,148 parts In-Stock

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$0.169

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$0.169

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Problanco Electronics

Mexico . 1,830 parts In-Stock

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1,830

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TANS Electronics

Latvia . 1,536 parts In-Stock

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1,536

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UHIMA Technologies

Türkiye . 624 parts In-Stock

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624

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Kulean Microsystems

USA . 469 parts In-Stock

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469

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Overview

Unleash the power of innovation with the NTD24N06-1G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. Whether you're looking to enhance your electronic devices or improve their performance, this N-CHANNEL FET offers unparalleled value and benefits. Trust in the reliability and efficiency of Onsemi's products, and elevate your projects to new heights with the NTD24N06-1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower ON-resistance compared to P-CHANNEL FETs, making them more efficient for many applications.

Configuration: SINGLE

SINGLE configuration allows for easy integration into circuit designs and simplifies the overall setup.

Surface Mount: YES

Surface mount technology enables compact and space-saving designs, ideal for modern electronics.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs are easier to use in most applications as they are normally off until a voltage is applied, allowing for better control.

Maximum Drain Current (Abs): 24 A

High drain current rating allows for handling larger loads or currents, making this FET suitable for power applications.

Maximum Power Dissipation (Abs): 62.5 W

High power dissipation capability ensures that the FET can handle high power levels without overheating, increasing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good performance and efficiency, commonly used in power FETs.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for operation in various environments without overheating, increasing flexibility.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and solderability, ensuring a reliable connection in electronic circuits.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables easy and reliable soldering during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTD24N06-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

NTD24N06-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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