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NTB85N08

Onsemi

NTB85N08 by Onsemi

The Onsemi NTB85N08 is a N-CHANNEL FET for SWITCHING applications. It features a DS Breakdown Voltage of 80V, GULL WING terminals, and operates in ENHANCEMENT MODE. This SMALL OUTLINE transistor uses METAL-OXIDE SEMICONDUCTOR tech with SILICON material, making it ideal for power management systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,420 parts In-Stock

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Digiode

USA . 2,404 parts In-Stock

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2,404

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Problanco Electronics

Mexico . 7,056 parts In-Stock

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7,056

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Kulean Microsystems

USA . 3,141 parts In-Stock

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3,141

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TANS Electronics

Latvia . 2,335 parts In-Stock

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Corphita

USA . 1,855 parts In-Stock

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1,855

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SupplyDigital Components

Austria . 778 parts In-Stock

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778

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UHIMA Technologies

Türkiye . 663 parts In-Stock

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663

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Corohmni

South Africa . 129 parts In-Stock

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Overview

Enhance your power management systems with the NTB85N08 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are reliable and efficient. Whether you're looking to improve switching applications or enhance overall performance, this N-channel transistor offers superior value and benefits. Its small outline package and single configuration make it perfect for a variety of applications. Trust Onsemi and elevate your power solutions with the NTB85N08.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes it easier to integrate the FET into electronic systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast and efficient switching capabilities for various electronic devices.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80V, this FET can handle higher voltage levels, making it suitable for applications where voltage spikes may occur.

Surface Mount: YES

The surface mount capability allows for easy and compact integration of the FET onto circuit boards, saving space and improving overall efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor for easy mounting and compatibility with various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections, ensuring reliable performance in the circuit.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control and modulation of the FET, making it ideal for applications requiring variable output.

No. of Terminals: 2

With only 2 terminals, the FET is simple to connect and operate, reducing the complexity of the circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and offers a compact form factor, making it suitable for applications with limited space constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology provides high-performance characteristics, low power consumption, and improved reliability for the FET.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, offering stable and consistent performance over a wide range of operating conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures a reliable electrical connection between the FET and the circuit board.

Terminal Position: SINGLE

With a single terminal position, the FET is easy to mount and connect in the circuit, simplifying the installation process.

Case Connection: DRAIN

The drain connection allows for efficient power dissipation and heat transfer, improving the overall thermal performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NTB85N08 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB85N08 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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