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NTB85N03

Onsemi

NTB85N03 by Onsemi

NTB85N03 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 61mJ EAS, operating in ENHANCEMENT MODE. With a max power dissipation of 80W and 0.0068 ohm RDS(on), it offers high performance in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,875 parts In-Stock

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4,875

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ComSIT Distribution GmbH

Germany . 310 parts In-Stock

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Digiode

USA . 153 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 1 parts In-Stock

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AZTECH Wire

Italy . 812 parts In-Stock

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$13.490

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Component Stockers USA

USA . 254 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,773 parts In-Stock

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Problanco Electronics

Mexico . 6,823 parts In-Stock

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TANS Electronics

Latvia . 3,926 parts In-Stock

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Corphita

USA . 1,466 parts In-Stock

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Kulean Microsystems

USA . 987 parts In-Stock

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UHIMA Technologies

Türkiye . 886 parts In-Stock

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SupplyDigital Components

Austria . 513 parts In-Stock

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Corohmni

South Africa . 257 parts In-Stock

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Overview

Enhance your power management solutions with the NTB85N03 by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-quality products that deliver reliable performance. The NTB85N03 falls under the Power Field Effect Transistors (FET) category and is designed for switching applications. With a maximum drain current of 85A and an on-resistance of just 0.0068 ohm, this transistor offers exceptional power dissipation and efficiency. Whether you're working on industrial machinery or automotive systems, the NTB85N03 provides the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and higher efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier design implementation and can help protect the circuit from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in a circuit.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on a circuit board.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltage applications without compromising performance.

Maximum Power Dissipation (Abs): 80 W

The high power dissipation rating allows for the FET to handle high power loads without overheating.

Maximum Drain-Source On Resistance: 0.0068 ohm

Low on resistance ensures minimal power loss and efficient operation of the FET.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without failure.

Technical Specifications

Power Field Effect Transistors (FET) NTB85N03 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

85 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.0068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB85N03 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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