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NTB85N08L

Onsemi

NTB85N08L by Onsemi

NTB85N08L by Onsemi is a N-CHANNEL FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration, GULL WING terminals, and operates in ENHANCEMENT MODE. This MOSFET has a PLASTIC/EPOXY body, RECTANGULAR shape, and is suitable for surface mount installations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,156 parts In-Stock

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2,156

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Digiode

USA . 2,068 parts In-Stock

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2,068

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,385 parts In-Stock

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7,385

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Kulean Microsystems

USA . 6,690 parts In-Stock

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6,690

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TANS Electronics

Latvia . 6,143 parts In-Stock

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6,143

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Problanco Electronics

Mexico . 2,589 parts In-Stock

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2,589

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Corphita

USA . 684 parts In-Stock

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684

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Corohmni

South Africa . 415 parts In-Stock

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415

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UHIMA Technologies

Türkiye . 259 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NTB85N08L from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that meet the highest standards. Ideal for switching applications, this N-channel power field effect transistor offers unparalleled performance and reliability. With a minimum DS breakdown voltage of 80V and an enhancement mode operating mode, customers can trust in the durability and efficiency of this product. Say goodbye to subpar performance and hello to seamless functionality with the NTB85N08L by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, ensuring a longer lifespan and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher efficiency compared to P-channel FETs, making them ideal for many switching applications.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for a wide range of applications and providing a safety margin.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving space and reducing production costs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs are known for their high switching speeds, low ON resistance, and excellent efficiency, making them a popular choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB85N08L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB85N08L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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