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NTB8N50

Onsemi

NTB8N50 by Onsemi

The Onsemi NTB8N50 is a N-CHANNEL FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 28A IDM and 320mJ EAS, suitable for high-power operations. With 0.75 ohm RDS(on) and 202W Pdiss, it offers efficient performance in a SMALL OUTLINE package.

Median Price

$0.685

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,250 parts In-Stock

1+ parts

-

100+ parts

$0.660

1k+ parts

$0.548

10k+ parts

$0.489

4,250

-

$0.660

$0.548

$0.489

DigiKey

USA . 4,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.830

10k+ parts

-

4,250

-

-

$0.830

-

Verical

USA . 4,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.685

10k+ parts

$0.611

4,250

-

-

$0.685

$0.611

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,283 parts In-Stock

1+ parts

$0.434

100+ parts

-

1k+ parts

-

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1,283

$0.434

-

-

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Digiode

USA . 270 parts In-Stock

1+ parts

$0.515

100+ parts

-

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270

$0.515

-

-

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DigiKey Marketplace

USA . 4,250 parts In-Stock

1+ parts

-

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4,250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 438 parts In-Stock

1+ parts

$0.434

100+ parts

-

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438

$0.434

-

-

-

Corphita

USA . 207 parts In-Stock

1+ parts

$0.488

100+ parts

-

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207

$0.488

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-

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Microchip USA

USA . 8,533 parts In-Stock

1+ parts

$3.380

100+ parts

-

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8,533

$3.380

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 21,306 parts In-Stock

1+ parts

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21,306

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Problanco Electronics

Mexico . 6,758 parts In-Stock

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6,758

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TANS Electronics

Latvia . 5,448 parts In-Stock

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5,448

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Continental Prestige Electronics

USA . 4,250 parts In-Stock

1+ parts

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100+ parts

$0.434

1k+ parts

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4,250

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$0.434

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Kulean Microsystems

USA . 4,003 parts In-Stock

1+ parts

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4,003

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UHIMA Technologies

Türkiye . 661 parts In-Stock

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661

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SupplyDigital Components

Austria . 171 parts In-Stock

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171

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Assy Fe

Spain . 4 parts In-Stock

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4

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Overview

Experience the power and reliability of the NTB8N50 by Onsemi, a top-tier manufacturer known for producing high-quality Power Field Effect Transistors (FET). Ideal for switching applications, this N-CHANNEL transistor offers unparalleled performance with its built-in diode configuration. With a minimum DS Breakdown Voltage of 500V and a Maximum Drain Current of 8A, this transistor provides exceptional value and efficiency. Trust Onsemi to deliver cutting-edge technology that meets your needs in a variety of industries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the FET lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility and lower ON-state resistance, providing better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against voltage spikes, enhancing the overall reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-state resistance, making it suitable for various power management tasks.

Surface Mount: YES

The surface-mount capability of this FET allows for easy and space-efficient integration onto circuit boards, perfect for compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate to switch ON, ensuring greater control and precision in power management applications.

Maximum Pulsed Drain Current (IDM): 28 A

The high maximum pulsed drain current allows the FET to handle sudden spikes in current without overheating or failing, ensuring reliable performance under heavy loads.

Maximum Power Dissipation (Abs): 202 W

With a high maximum power dissipation rating, this FET can efficiently handle power surges and high operating temperatures, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

The FET's ability to operate at temperatures up to 150 °C makes it suitable for high-temperature environments, providing excellent reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) NTB8N50 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

320 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB8N50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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