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NTB85N03G

Onsemi

NTB85N03G by Onsemi

NTB85N03G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 85A Max ID. Ideal for SWITCHING applications, it features a built-in diode, 45A IDM, and 0.0068 ohm RDS(on). Suitable for surface mount with GULL WING terminals, it operates in ENHANCEMENT MODE up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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AZTECH Wire

Italy . 1,168 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 7,178 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

Canada . 5,030 parts In-Stock

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SupplyDigital Components

Austria . 3,923 parts In-Stock

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Corphita

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Corohmni

South Africa . 491 parts In-Stock

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Overview

Experience the superior performance and reliability of the NTB85N03G by Onsemi, a leading manufacturer in the industry. This Power Field Effect Transistor (FET) offers unmatched quality and efficiency for various applications such as switching. With a maximum drain current of 85A and a low on-resistance of 0.0068 ohm, this N-CHANNEL transistor delivers exceptional power handling capabilities. Trust in Onsemi's reputation for excellence and elevate your projects with the NTB85N03G for optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, making it ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and lower on-resistance compared to P-Channel FETs, making this product a good choice for high-efficiency applications.

Maximum Pulsed Drain Current (IDM): 45 A

The high maximum pulsed drain current rating of 45 A allows this FET to handle high peak currents, making it suitable for applications where short pulses of high current are required.

Maximum Power Dissipation (Abs): 80 W

With a maximum power dissipation of 80 W, this FET can handle high power levels efficiently without overheating, making it a reliable choice for power switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows this FET to operate reliably in high-temperature environments, making it suitable for industrial and automotive applications.

Terminal Finish: TIN

The tin terminal finish provides good solderability and conductivity, ensuring a reliable electrical connection, making this product easy to work with during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTB85N03G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

85 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.0068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB85N03G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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