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NTB75N06LT4

Onsemi

NTB75N06LT4 by Onsemi

NTB75N06LT4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 225A IDM, and 0.011 ohm RDS(on). Ideal for SWITCHING applications due to its 214W Pdiss, 175 °C Temp Rating, and EAS of 844mJ. Package: PLASTIC/EPOXY, GULL WING Terminals, ENHANCEMENT MODE operation.

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Vyrian

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AZTECH Wire

Italy . 200 parts In-Stock

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SupplyDigital Components

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Kepictronics

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TANS Electronics

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Problanco Electronics

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UHIMA Technologies

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Kulean Microsystems

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Overview

Enhance your power applications with the NTB75N06LT4 by Onsemi, a high-quality N-channel Power FET designed for switching operations. Manufactured with precision and reliability in mind, this transistor offers exceptional performance with its built-in diode configuration. Ideal for a wide range of industrial and automotive applications, this transistor delivers maximum efficiency and power dissipation, making it a valuable asset to any project. Trust Onsemi to provide superior components that meet your power needs with unparalleled quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and lower resistance, making them more efficient for switching applications compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and can protect the FET from voltage spikes or reverse current flow, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON resistance, making it ideal for high-frequency and high-efficiency circuits.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient PCB assembly, saving time and labor costs during manufacturing.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltage levels, offering a wider range of applications and ensuring reliable performance in various voltage conditions.

Maximum Pulsed Drain Current (IDM): 225 A

The high pulsed drain current rating of 225A allows the FET to handle large current spikes or surges, making it suitable for demanding applications with high peak currents.

Avalanche Energy Rating (EAS): 844 mJ

The high avalanche energy rating of 844mJ indicates the FET's ability to withstand transient or avalanche conditions without damage, ensuring long-term reliability in rugged operating environments.

Maximum Drain-Source On Resistance: 0.011 ohm

The low ON resistance of 0.011 ohm results in minimal power dissipation and voltage drop across the FET, maximizing efficiency and reducing heat generation during operation.

Maximum Drain Current (ID): 75 A

With a maximum drain current of 75A, this FET can handle high continuous currents without overheating, allowing for reliable performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB75N06LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

844 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

225 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB75N06LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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