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NTB70N08L

Onsemi

NTB70N08L by Onsemi

The Onsemi NTB70N08L is a N-CHANNEL FET with 80V DS Breakdown Voltage, suitable for SWITCHING applications. It features GULL WING terminals, ENHANCEMENT MODE operation, and METAL-OXIDE SEMICONDUCTOR technology. The PLASTIC/EPOXY package is RECTANGULAR in shape and has a SMALL OUTLINE style, making it ideal for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,977 parts In-Stock

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Digiode

USA . 1,071 parts In-Stock

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1,071

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Problanco Electronics

Mexico . 5,684 parts In-Stock

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5,684

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TANS Electronics

Latvia . 5,274 parts In-Stock

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Kulean Microsystems

USA . 1,613 parts In-Stock

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Corphita

USA . 1,440 parts In-Stock

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SupplyDigital Components

Austria . 785 parts In-Stock

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Corohmni

South Africa . 455 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Overview

Upgrade your power systems with the NTB70N08L by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. The NTB70N08L offers a minimum DS Breakdown Voltage of 80V and operates in Enhancement Mode, providing reliable performance for all your power needs. With its N-CHANNEL configuration and compact SMALL OUTLINE package style, this transistor is surface mountable for easy installation. Trust Onsemi to provide cutting-edge technology and superior materials, ensuring long-lasting durability and efficiency. Say goodbye to power disruptions and hello to seamless performance with the NTB70N08L.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the specified direction, enhancing the product's performance.

Configuration: SINGLE

Simplified and straightforward design for ease of use and integration within various electronic circuits.

Transistor Application: SWITCHING

Optimized for fast switching operations, making it ideal for applications requiring quick response times.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 80 V

High breakdown voltage ensures the product can handle higher voltages, improving its reliability and safety margin.

Package Shape: RECTANGULAR

Compact shape facilitates efficient placement on circuit boards and allows for a neat and organized layout.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection, reducing the risk of disconnection or malfunction.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the transistor's conductivity, enabling versatile usage.

No. of Terminals: 2

Simplified terminal configuration makes the product more user-friendly and easier to implement in circuits.

Package Style (Meter): SMALL OUTLINE

Compact and lightweight package style saves space and enhances portability for various electronic applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers efficient and reliable performance, ensuring optimal functionality.

Transistor Element Material: SILICON

Silicon material provides high reliability and performance, making the transistor suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead finish enhances the terminals' conductivity and durability, improving overall product quality.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection processes, enhancing user convenience.

Case Connection: DRAIN

Drain connection offers efficient current handling capabilities, ensuring the transistor operates effectively under various conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTB70N08L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB70N08L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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