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NTB75N03R

Onsemi

NTB75N03R by Onsemi

NTB75N03R by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 225A IDM, and 0.013 ohm RDS. Ideal for SWITCHING applications due to its 74.4W Pdiss, 71.7mJ EAS rating, and ENHANCEMENT MODE operation at up to 150 °C temp.

Median Price

$2.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

1,050

-

$0.291

$0.241

$0.215

Verical

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

$13.275

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1,050

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$13.275

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Master Electronics

USA . 447 parts In-Stock

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-

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$2.170

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$1.470

10k+ parts

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447

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$2.170

$1.470

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Distributors (In-Stock)

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Digiode

USA . 2,483 parts In-Stock

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$0.226

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$0.226

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Vyrian

USA . 2,418 parts In-Stock

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$0.238

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$0.238

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Distributors (Availability)

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Corphita

USA . 303 parts In-Stock

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$0.214

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303

$0.214

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Corohmni

South Africa . 366 parts In-Stock

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$0.238

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366

$0.238

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.832

100+ parts

$0.757

1k+ parts

$0.682

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-

3,000

$0.832

$0.757

$0.682

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Kulean Microsystems

USA . 7,507 parts In-Stock

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7,507

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TANS Electronics

Latvia . 7,268 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,354 parts In-Stock

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SupplyDigital Components

Austria . 3,219 parts In-Stock

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Problanco Electronics

Mexico . 1,255 parts In-Stock

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UHIMA Technologies

Türkiye . 283 parts In-Stock

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Perfect Parts

USA . 269 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 120 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Discover the NTB75N03R by Onsemi, a high-quality Power FET that offers unmatched performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-CHANNEL transistor is perfect for switching applications. Its single configuration with built-in diode ensures seamless operation, while its compact design makes it ideal for surface mount installation. Providing a maximum drain current of 75A and a low on resistance, the NTB75N03R delivers exceptional value and efficiency for your projects. Upgrade to Onsemi for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, making it suitable for a variety of applications and environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current carrying capability, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection, enhancing the reliability and performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various electronic circuits.

Surface Mount: YES

Surface mount technology provides easy PCB assembly and compact design, saving space and cost in the manufacturing process.

Minimum DS Breakdown Voltage: 25 V

The high breakdown voltage allows for safe operation in high voltage applications, providing protection against voltage spikes.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints and ensure reliable connection in surface mount applications.

Maximum Power Dissipation (Abs): 74.4 W

The high power dissipation rating allows the FET to handle high power loads without overheating, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, the FET can withstand high temperature environments, making it suitable for a wide range of industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTB75N03R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

71.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

9.7 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

225 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB75N03R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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