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NTB18N06LG

Onsemi

NTB18N06LG by Onsemi

NTB18N06LG by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 45A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.1 ohm RDS(on), and 48.4W Pdiss in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,277 parts In-Stock

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Digiode

USA . 775 parts In-Stock

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AZTECH Wire

Italy . 496 parts In-Stock

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$11.330

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,626 parts In-Stock

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Problanco Electronics

Mexico . 6,315 parts In-Stock

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TANS Electronics

Latvia . 5,954 parts In-Stock

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SupplyDigital Components

Austria . 5,087 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 3,968 parts In-Stock

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Corphita

USA . 1,183 parts In-Stock

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UHIMA Technologies

Türkiye . 591 parts In-Stock

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Corohmni

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Overview

Experience unparalleled power and performance with the NTB18N06LG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors. Ideal for switching applications, this N-CHANNEL transistor offers enhanced efficiency and versatility. With a maximum drain current of 15A and a low on-resistance of 0.1 ohm, this transistor provides exceptional value and benefits to customers looking for high-performance solutions. Trust Onsemi to deliver superior products that meet your power needs with precision and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power applications due to their high efficiency and fast switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient energy dissipation during switching operations, improving overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuits.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy placement on a circuit board.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connections, improving reliability and signal integrity.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast and precise control of the flow of current, making them ideal for switching applications.

Maximum Pulsed Drain Current (IDM): 45 A

High pulsed drain current capability allows for handling short bursts of high current, suitable for demanding industrial applications.

Avalanche Energy Rating (EAS): 61 mJ

High avalanche energy rating ensures the FET can withstand transient voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 15 A

Capable of handling continuous high currents, making it suitable for power applications.

No. of Terminals: 2

Simplified two-terminal design allows for easy integration into circuits.

Maximum Power Dissipation (Abs): 48.4 W

High power dissipation capability enables the FET to handle high power loads without overheating.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style makes it suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high-performance characteristics and reliability.

Maximum Operating Temperature: 175 °C

With high maximum operating temperature, this FET can withstand harsh environmental conditions.

Transistor Element Material: SILICON

Silicon-based materials offer excellent electrical properties and durability.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and strong solder connections.

Maximum Drain Current (ID): 15 A

Ideal for applications requiring high continuous current capability.

Maximum Drain-Source On Resistance: 0.1 ohm

Low on-resistance ensures efficient power transfer and minimal voltage drop.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and installation process.

Case Connection: DRAIN

Drain case connection offers a direct path for current flow, improving efficiency.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance allows for reliable soldering during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTB18N06LG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTB18N06LG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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