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NLVVHCT50ADTR2G

Onsemi

NLVVHCT50ADTR2G by Onsemi

BUFFER; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 45 parts In-Stock

1+ parts

$2.230

100+ parts

-

1k+ parts

-

10k+ parts

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45

$2.230

-

-

-

Rochester

USA . 10,201 parts In-Stock

1+ parts

-

100+ parts

$0.255

1k+ parts

$0.211

10k+ parts

$0.189

10,201

-

$0.255

$0.211

$0.189

Verical

USA . 8,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.264

8,902

-

-

-

$0.264

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.235

5,000

-

-

-

$0.235

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 226 parts In-Stock

1+ parts

$0.199

100+ parts

-

1k+ parts

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10k+ parts

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226

$0.199

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-

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Flip Electronics

USA . 250,000 parts In-Stock

1+ parts

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250,000

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Chip Stock

USA . 16,486 parts In-Stock

1+ parts

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16,486

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ComSIT Distribution GmbH

Germany . 4,072 parts In-Stock

1+ parts

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4,072

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Vyrian

USA . 3,593 parts In-Stock

1+ parts

-

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3,593

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-

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Cyclops Electronics Ltd

UK . 2,263 parts In-Stock

1+ parts

-

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2,263

-

-

-

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Bristol Electronics

USA . 181 parts In-Stock

1+ parts

-

100+ parts

$0.366

1k+ parts

$0.211

10k+ parts

-

181

-

$0.366

$0.211

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 680 parts In-Stock

1+ parts

$0.188

100+ parts

-

1k+ parts

-

10k+ parts

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680

$0.188

-

-

-

Corohmni

South Africa . 217 parts In-Stock

1+ parts

$0.209

100+ parts

-

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217

$0.209

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Ampacity Inc.

Singapore . 1,638 parts In-Stock

1+ parts

$0.387

100+ parts

-

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10k+ parts

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1,638

$0.387

-

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-

Component Stockers USA

USA . 72 parts In-Stock

1+ parts

$0.510

100+ parts

-

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72

$0.510

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Vigor

Singapore . 688 parts In-Stock

1+ parts

$0.560

100+ parts

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688

$0.560

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AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$12.030

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334

$12.030

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RC Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

$0.390

1k+ parts

$0.370

10k+ parts

$0.360

20,000

-

$0.390

$0.370

$0.360

Perfect Parts

USA . 6,209 parts In-Stock

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6,209

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 4,359 parts In-Stock

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4,359

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Formix International (Excess)

India . 2,500 parts In-Stock

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2,500

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iodParts Technologies Inc.

India . 2,103 parts In-Stock

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Kulean Microsystems

USA . 2,029 parts In-Stock

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2,029

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Problanco Electronics

Mexico . 1,742 parts In-Stock

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1,742

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TANS Electronics

Latvia . 912 parts In-Stock

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912

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UHIMA Technologies

Türkiye . 808 parts In-Stock

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808

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Microchip USA

USA . 576 parts In-Stock

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576

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Futuretech Components

Singapore . 540 parts In-Stock

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540

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Authorized Procurement Solutions

USA . 75 parts In-Stock

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75

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Technical Specifications

Logic Gates NLVVHCT50ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

11.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLVVHCT50ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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