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NLVVHC1GT14DFT2G

Onsemi

NLVVHC1GT14DFT2G by Onsemi

NLVVHC1GT14DFT2G by Onsemi is a CMOS Logic Gate with Schmitt Trigger. It operates at 3V, has 5 terminals, and a load capacitance of 50pF. Ideal for military applications due to its AEC-Q100 screening level and wide temperature range (-55 to 125 °C).

Median Price

$0.146

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 79,888 parts In-Stock

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-

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$0.152

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$0.127

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$0.113

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$0.152

$0.127

$0.113

Verical

USA . 79,888 parts In-Stock

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$0.141

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$0.141

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Digiode

USA . 1,211 parts In-Stock

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$0.119

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Nova Conductors

Japan . 99 parts In-Stock

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$0.163

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Vyrian

USA . 8,726 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Corphita

USA . 188 parts In-Stock

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$0.112

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Corohmni

South Africa . 97 parts In-Stock

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$0.125

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AZTECH Wire

Italy . 525 parts In-Stock

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$11.220

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525

$11.220

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Component Stockers USA

USA . 704 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,124 parts In-Stock

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Kulean Microsystems

USA . 5,129 parts In-Stock

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SupplyDigital Components

Austria . 5,057 parts In-Stock

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Problanco Electronics

Mexico . 4,338 parts In-Stock

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Vigor

Singapore . 536 parts In-Stock

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UHIMA Technologies

Türkiye . 491 parts In-Stock

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Microchip USA

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Overview

Discover the cutting-edge NLVVHC1GT14DFT2G by Onsemi, a high-quality Logic Gate that exceeds industry standards. Manufactured by Onsemi, known for its reliability and innovation, this product is ideal for a wide range of applications. With a nominal supply voltage of 3V and a maximum seated height of just 1.1mm, this compact and efficient logic gate offers unmatched performance. Experience the benefits of fast propagation delay, Schmitt Trigger technology, and a wide temperature range. Trust Onsemi to deliver top-notch quality and value with the NLVVHC1GT14DFT2G Logic Gate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage level for stable and efficient operation of the logic gates.

Propagation Delay (tpd): 20.5 ns

Fast response time ensures quick signal processing and reduces overall system latency.

Maximum Operating Temperature: 125 °C

Suitable for a wide range of operating environments, ensuring reliable performance even in high-temperature conditions.

Technical Specifications

Logic Gates NLVVHC1GT14DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

20.5 ns

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1GT14DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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