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NLV74AC00DR2G

Onsemi

NLV74AC00DR2G by Onsemi

NLV74AC00DR2G by Onsemi is a 4-function logic gate with 2 inputs, operating at supply voltages from 2V to 6V. With a propagation delay of 11ns, it's ideal for military-grade applications requiring fast response times. This CMOS technology device comes in a small outline package suitable for surface mount assembly.

Median Price

$0.281

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,515 parts In-Stock

1+ parts

-

100+ parts

$0.292

1k+ parts

$0.242

10k+ parts

$0.216

5,515

-

$0.292

$0.242

$0.216

Verical

USA . 5,515 parts In-Stock

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-

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$0.270

5,515

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$0.270

Distributors (In-Stock)

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Digiode

USA . 875 parts In-Stock

1+ parts

$0.227

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875

$0.227

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Vyrian

USA . 2,295 parts In-Stock

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2,295

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Distributors (Availability)

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Corphita

USA . 447 parts In-Stock

1+ parts

$0.215

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447

$0.215

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Corohmni

South Africa . 97 parts In-Stock

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$0.237

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97

$0.237

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Microchip USA

USA . 4,408 parts In-Stock

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$1.721

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4,408

$1.721

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AZTECH Wire

Italy . 1,182 parts In-Stock

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$17.700

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$17.700

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$23.266

100+ parts

$21.172

1k+ parts

$19.078

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-

3,000

$23.266

$21.172

$19.078

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Problanco Electronics

Mexico . 7,469 parts In-Stock

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7,469

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Continental Prestige Electronics

USA . 5,515 parts In-Stock

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$0.290

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5,515

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$0.290

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SupplyDigital Components

Austria . 5,042 parts In-Stock

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Kulean Microsystems

USA . 3,758 parts In-Stock

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TANS Electronics

Latvia . 863 parts In-Stock

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Vigor

Singapore . 498 parts In-Stock

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UHIMA Technologies

Türkiye . 462 parts In-Stock

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Overview

Looking for high-quality logic gates that deliver top-notch performance? Look no further than the NLV74AC00DR2G by Onsemi. With a reputation for excellence in semiconductor manufacturing, Onsemi brings you a reliable and efficient solution for your logic gate needs. Ideal for a wide range of applications, this product offers customers unparalleled value, benefits, and advantages. Trust Onsemi to provide you with the best in semiconductor technology with the NLV74AC00DR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving time and effort.

No. of Functions: 4

Having 4 functions in one component provides increased functionality and integration, reducing the need for multiple separate components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it convenient for most applications.

Propagation Delay (tpd): 11 ns

Low propagation delay of 11ns results in fast response times, making the product suitable for high-speed operations.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows the product to withstand harsh environmental conditions and operate reliably in various applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C ensures the product can function in cold environments without any issues.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and solderability, ensuring reliable electrical connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NLV74AC00DR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

11 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV74AC00DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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