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NLU3G16MUTCG

Onsemi

NLU3G16MUTCG by Onsemi

NLU3G16MUTCG by Onsemi is a logic gate with 3 functions, operating at 3.3V. It features a propagation delay of 14.5ns and can withstand temperatures from -55 to 125 °C. Ideal for military-grade applications requiring compact, low-power logic solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,150 parts In-Stock

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Digiode

USA . 499 parts In-Stock

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Component Stockers USA

USA . 638 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 12,067 parts In-Stock

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Kulean Microsystems

USA . 8,218 parts In-Stock

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TANS Electronics

Latvia . 6,733 parts In-Stock

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SupplyDigital Components

Austria . 4,916 parts In-Stock

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Corphita

USA . 617 parts In-Stock

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Problanco Electronics

Mexico . 563 parts In-Stock

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UHIMA Technologies

Türkiye . 359 parts In-Stock

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Microchip USA

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Corohmni

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Overview

Elevate your electronic designs with the NLU3G16MUTCG by Onsemi, a high-quality logic gate that offers unparalleled performance and reliability. Designed with precision by Onsemi, this surface mount logic gate boasts three functions in a compact package, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and a propagation delay of just 14.5 ns, this versatile component delivers fast and efficient operation. Trust Onsemi to provide cutting-edge technology that meets your needs, whether you're working on military-grade projects or commercial applications. Experience the difference with the NLU3G16MUTCG - innovation at its finest.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient installation of the logic gates onto circuit boards, making them ideal for space-constrained applications.

No. of Functions: 3

Having multiple functions in a single package provides flexibility and efficiency in designing complex logic circuits.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily mountable on circuit boards, simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with a wide range of existing systems and components.

Propagation Delay (tpd): 14.5 ns

Low propagation delay allows for fast execution of logic operations, enhancing the overall performance of the circuit.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these logic gates can withstand harsh environmental conditions and ensure reliable operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable for various applications.

Maximum Seated Height: 0.55 mm

Compact and low profile design enables easier integration into tight spaces or applications with height restrictions.

Technical Specifications

Logic Gates NLU3G16MUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

3G

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

1.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NLU3G16MUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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