Loading...

NLU3G17DMUTCG

Onsemi

NLU3G17DMUTCG by Onsemi

NLU3G17DMUTCG by Onsemi is a CMOS Logic Gate with 20.5 ns Propagation Delay, suitable for military-grade applications. It operates at a supply voltage range of 1.65V to 5.5V and features Schmitt Trigger technology, making it ideal for high-speed signal processing in compact electronic devices. With a small outline package style and surface-mount capability, this device offers efficient integration into space-constrained PCB designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,333

-

-

-

-

Vyrian

USA . 947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

947

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,288

-

-

-

-

Problanco Electronics

Mexico . 4,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

-

-

-

-

SupplyDigital Components

Austria . 3,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,918

-

-

-

-

TANS Electronics

Latvia . 2,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,585

-

-

-

-

Corphita

USA . 1,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,566

-

-

-

-

UHIMA Technologies

Türkiye . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

662

-

-

-

-

Corohmni

South Africa . 130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

130

-

-

-

-

Overview

Elevate your electronic projects with the NLU3G17DMUTCG by Onsemi! This high-quality logic gate offers unparalleled performance and reliability, thanks to the reputable manufacturer. Ideal for a wide range of applications, this product provides customers with fast and efficient signal processing capabilities. Say goodbye to slow response times and hello to enhanced functionality. Upgrade your circuits today with the NLU3G17DMUTCG - your solution for superior quality and optimal performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 20.5 ns

With a fast propagation delay, this product ensures quick signal processing and response times.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs.

No. of Functions: 3

Having multiple functions in one component provides cost-effectiveness and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 2

Operating at a low supply voltage of 2V helps in reducing power consumption and heat generation.

Load Capacitance (CL): 50 pF

With a moderate load capacitance, this product can efficiently drive connected components without causing signal distortion.

Power Supplies (V): 1.8/5

Supports multiple power supply voltages for versatile compatibility in different circuit configurations.

No. of Terminals: 8

Having 8 terminals allows for connecting to various components and facilitates flexible circuit integration.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and compatibility with a wide range of voltages.

Maximum Operating Temperature: 125 °C

Operates reliably even in high-temperature environments, which enhances the product's durability and reliability.

Technical Specifications

Logic Gates NLU3G17DMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

3G

JESD-30 Code:

R-PDSO-N8

Length:

1.95 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

20.5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU3G17DMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19