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NLU3G14CMX1TCG

Onsemi

NLU3G14CMX1TCG by Onsemi

NLU3G14CMX1TCG by Onsemi is a CMOS Logic Gate with 20.5 ns Propagation Delay, suitable for military-grade applications. It operates at a supply voltage range of 1.65V to 5.5V and features Schmitt Trigger technology, making it ideal for high-speed signal processing in harsh environments. This small-outline package has 8 terminals and can handle up to 4 Amps of current with a temperature range from -55 °C to 125°C.

Median Price

$0.147

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,985 parts In-Stock

1+ parts

$0.924

100+ parts

$0.295

1k+ parts

$0.227

10k+ parts

-

2,985

$0.924

$0.295

$0.227

-

Rochester

USA . 87,000 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

87,000

-

$0.159

$0.132

$0.117

Avnet

USA . 87,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.140

10k+ parts

$0.130

87,000

-

-

$0.140

$0.130

DigiKey

USA . 87,000 parts In-Stock

1+ parts

-

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$0.140

87,000

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$0.140

Verical

USA . 87,000 parts In-Stock

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-

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$0.147

87,000

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-

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$0.147

Distributors (In-Stock)

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Vyrian

USA . 346 parts In-Stock

1+ parts

$0.111

100+ parts

-

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346

$0.111

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Digiode

USA . 356 parts In-Stock

1+ parts

$0.124

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356

$0.124

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 66 parts In-Stock

1+ parts

$0.111

100+ parts

-

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66

$0.111

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Corphita

USA . 2,100 parts In-Stock

1+ parts

$0.117

100+ parts

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2,100

$0.117

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Vigor

Singapore . 470 parts In-Stock

1+ parts

$0.120

100+ parts

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470

$0.120

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Continental Prestige Electronics

USA . 87,000 parts In-Stock

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$0.113

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87,000

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$0.113

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Perfect Parts

USA . 20,496 parts In-Stock

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20,496

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Kulean Microsystems

USA . 8,369 parts In-Stock

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8,369

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TANS Electronics

Latvia . 6,237 parts In-Stock

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6,237

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,553 parts In-Stock

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2,553

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SupplyDigital Components

Austria . 1,817 parts In-Stock

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1,817

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Microchip USA

USA . 461 parts In-Stock

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461

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UHIMA Technologies

Türkiye . 118 parts In-Stock

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118

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Overview

Elevate your project with the high-quality NLU3G14CMX1TCG logic gates from Onsemi. With a compact design and reliable performance, this product offers unmatched precision and efficiency for a wide range of applications. Whether you're designing consumer electronics or industrial automation systems, trust Onsemi to deliver exceptional products that meet your needs. Experience the value and benefits of Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 20.5 ns

Low propagation delay ensures fast signal processing and high-speed operation.

Surface Mount: YES

Surface mount technology allows for easy and compact placement on PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular package shape offers easy integration into various circuit designs.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common voltage level, making it compatible with many systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reduced noise.

Schmitt Trigger: YES

Includes Schmitt trigger for better noise immunity and signal conditioning.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLU3G14CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

3G

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

20.5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU3G14CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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