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NLU3G17CMX1TCG

Onsemi

NLU3G17CMX1TCG by Onsemi

NLU3G17CMX1TCG by Onsemi is a CMOS Logic Gate with 20.5 ns Propagation Delay, suitable for military-grade applications. It operates at a supply voltage range of 1.65V to 5.5V and features Schmitt Trigger technology, making it ideal for high-speed signal processing in harsh environments. The compact package style with small outline and very thin profile makes it suitable for space-constrained designs requiring fast response times.

Median Price

$0.153

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

90,000

-

$0.159

$0.132

$0.117

Verical

USA . 90,000 parts In-Stock

1+ parts

-

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10k+ parts

$0.147

90,000

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-

-

$0.147

Distributors (In-Stock)

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Digiode

USA . 324 parts In-Stock

1+ parts

$0.124

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324

$0.124

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Vyrian

USA . 119 parts In-Stock

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$0.130

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119

$0.130

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Distributors (Availability)

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Corphita

USA . 344 parts In-Stock

1+ parts

$0.117

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$0.117

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Vigor

Singapore . 333 parts In-Stock

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$0.120

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333

$0.120

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Component Stockers USA

USA . 104,332 parts In-Stock

1+ parts

$0.130

100+ parts

$0.130

1k+ parts

$0.110

10k+ parts

$0.110

104,332

$0.130

$0.130

$0.110

$0.110

Corohmni

South Africa . 405 parts In-Stock

1+ parts

$0.130

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405

$0.130

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Advanced Electronics

New Zealand . 3,600 parts In-Stock

1+ parts

$32.845

100+ parts

$32.517

1k+ parts

$31.203

10k+ parts

-

3,600

$32.845

$32.517

$31.203

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Continental Prestige Electronics

USA . 90,000 parts In-Stock

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$0.113

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$0.113

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kulean Microsystems

USA . 7,626 parts In-Stock

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Problanco Electronics

Mexico . 5,936 parts In-Stock

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TANS Electronics

Latvia . 3,662 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,544 parts In-Stock

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 21 parts In-Stock

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Overview

Discover the innovative NLU3G17CMX1TCG logic gates by Onsemi, designed with precision and reliability in mind. With a low propagation delay of 20.5 ns, this product is ideal for applications requiring fast response times. Whether you're working on military-grade projects or high-speed electronics, the NLU3G17CMX1TCG offers unmatched performance and efficiency. Trust Onsemi's expertise in semiconductor manufacturing to deliver top-of-the-line products that meet your needs. Upgrade your designs with the ultimate combination of quality and value that only Onsemi can provide.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 20.5 ns

Low propagation delay ensures fast response time and efficient performance.

Surface Mount: YES

Surface mount technology allows for compact and easy installation on PCBs.

Package Shape: SQUARE

Square package shape provides uniformity and stability during mounting.

Nominal Supply Voltage / Vsup (V): 3

Suitable supply voltage ensures compatibility with common power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance for reliable operation in various applications.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages enhances versatility in circuit design.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for use in diverse environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in extreme cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Logic Gates NLU3G17CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

3G

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

20.5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU3G17CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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