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NLU2G17CMUTCG

Onsemi

NLU2G17CMUTCG by Onsemi

NLU2G17CMUTCG by Onsemi is a CMOS Logic Gate with 20.5ns Propagation Delay, suitable for military applications. It operates at a supply voltage range of 1.65V to 5.5V and features Schmitt Trigger technology, making it ideal for high-reliability circuits in harsh environments. This small outline package has dual terminals and can withstand temperatures from -55 °C to 125°C, offering robust performance in extreme conditions.

Median Price

$0.434

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 530 parts In-Stock

1+ parts

$0.600

100+ parts

$0.374

1k+ parts

$0.231

10k+ parts

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530

$0.600

$0.374

$0.231

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Flip Electronics (Authorized)

USA . 2,386 parts In-Stock

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Rochester

USA . 200 parts In-Stock

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100+ parts

$0.267

1k+ parts

$0.222

10k+ parts

$0.198

200

-

$0.267

$0.222

$0.198

Distributors (In-Stock)

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Digiode

USA . 1,726 parts In-Stock

1+ parts

$0.208

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1,726

$0.208

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Chip Stock

USA . 75,000 parts In-Stock

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Vyrian

USA . 8,215 parts In-Stock

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Flip Electronics

USA . 2,386 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,397 parts In-Stock

1+ parts

$0.197

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$0.197

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Corohmni

South Africa . 93 parts In-Stock

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$0.219

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93

$0.219

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QUARKTWIN TECHNOLOGY LTD

USA . 10,835 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,648 parts In-Stock

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Microchip USA

USA . 6,990 parts In-Stock

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Problanco Electronics

Mexico . 6,109 parts In-Stock

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SupplyDigital Components

Austria . 1,443 parts In-Stock

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Kulean Microsystems

USA . 1,171 parts In-Stock

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UHIMA Technologies

Türkiye . 743 parts In-Stock

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743

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Overview

Elevate your projects with the NLU2G17CMUTCG by Onsemi, a high-quality logic gate designed to enhance performance and efficiency. Manufactured by industry leader Onsemi, this product offers reliability and precision in a compact square package. With a fast propagation delay and dual function design, this logic gate is perfect for a wide range of applications. Whether you're working on military-grade projects or everyday electronics, this product delivers exceptional value and benefits. Upgrade your designs with the NLU2G17CMUTCG and experience the advantages of top-tier technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 20.5 ns

Fast propagation delay ensures quick response times for signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it reliable in a variety of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates efficient and reliable in digital systems.

Technical Specifications

Logic Gates NLU2G17CMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

20.5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU2G17CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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