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NLU2G06AMX1TCG

Onsemi

NLU2G06AMX1TCG by Onsemi

NLU2G06AMX1TCG by Onsemi is a Logic Gate with 14.5ns Propagation Delay, 50pF Load Capacitance, and 4A Max I (ol). Ideal for military applications due to its MILITARY Temperature Grade and CMOS Technology. It features a PLASTIC/EPOXY Package Body Material and operates at a Nominal Voltage of 5V.

Median Price

$0.106

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,435 parts In-Stock

1+ parts

$0.693

100+ parts

$0.221

1k+ parts

$0.170

10k+ parts

-

2,435

$0.693

$0.221

$0.170

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Rochester

USA . 195,000 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

195,000

-

$0.092

$0.077

$0.068

DigiKey

USA . 195,000 parts In-Stock

1+ parts

-

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$0.120

195,000

-

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$0.120

Verical

USA . 108,000 parts In-Stock

1+ parts

-

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-

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$0.086

108,000

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-

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$0.086

Distributors (In-Stock)

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Digiode

USA . 1,967 parts In-Stock

1+ parts

$0.072

100+ parts

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1,967

$0.072

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Vyrian

USA . 2,119 parts In-Stock

1+ parts

$0.076

100+ parts

-

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2,119

$0.076

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 83 parts In-Stock

1+ parts

$0.068

100+ parts

-

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-

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83

$0.068

-

-

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Vigor

Singapore . 480 parts In-Stock

1+ parts

$0.070

100+ parts

-

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480

$0.070

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Corohmni

South Africa . 499 parts In-Stock

1+ parts

$0.076

100+ parts

-

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499

$0.076

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Component Stockers USA

USA . 181,342 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

$0.070

181,342

$0.080

$0.070

$0.070

$0.070

Continental Prestige Electronics

USA . 195,000 parts In-Stock

1+ parts

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100+ parts

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$0.066

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195,000

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$0.066

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Perfect Parts

USA . 23,313 parts In-Stock

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23,313

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Problanco Electronics

Mexico . 2,520 parts In-Stock

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2,520

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GreenTree Electronics

Israel . 2,435 parts In-Stock

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2,435

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Kulean Microsystems

USA . 1,771 parts In-Stock

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1,771

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SupplyDigital Components

Austria . 952 parts In-Stock

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952

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UHIMA Technologies

Türkiye . 905 parts In-Stock

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905

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TANS Electronics

Latvia . 745 parts In-Stock

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745

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Microchip USA

USA . 330 parts In-Stock

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330

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Overview

Discover the NLU2G06AMX1TCG by Onsemi, a premium Logic Gates component designed to deliver high-performance functionality for a variety of applications. With a reputation for superior quality and reliability, Onsemi ensures that this product meets the highest industry standards. Ideal for military-grade projects, this Logic Gate offers a fast propagation delay, open-drain output characteristics, and a compact design, making it a versatile choice for your electronic needs. Experience the value and benefits that Onsemi brings to the table with the NLU2G06AMX1TCG, delivering efficiency and precision in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal processing and efficient operation of the logic gates.

Surface Mount: YES

Surface mount design allows for easy installation and integration into electronic circuits.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently with a standard 5V power supply, making it compatible with many electronic systems.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for flexible interfacing with other components and devices in the circuit.

Technical Specifications

Logic Gates NLU2G06AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU2G06AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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