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NLU2G04CMUTCG

Onsemi

NLU2G04CMUTCG by Onsemi

NLU2G04CMUTCG by Onsemi is a CMOS Logic Gate with 14.5ns Propagation Delay, suitable for military applications. It operates at a supply voltage range of 1.65V to 5.5V and has a load capacitance of 50pF, making it ideal for high-speed signal processing in harsh environments. This surface-mount device features dual terminals and a small outline package style, ensuring reliable performance in compact designs.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 51,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 51,000 parts In-Stock

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Rochester

USA . 15,000 parts In-Stock

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$0.137

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$0.114

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$0.102

15,000

-

$0.137

$0.114

$0.102

Farnell

UK . 15,000 parts In-Stock

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$0.095

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$0.095

Verical

USA . 12,000 parts In-Stock

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$0.127

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Distributors (In-Stock)

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Vyrian

USA . 1,687 parts In-Stock

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$0.095

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1,687

$0.095

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Digiode

USA . 638 parts In-Stock

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$0.112

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$0.112

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Flip Electronics

USA . 51,000 parts In-Stock

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Chip Stock

USA . 22,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 94 parts In-Stock

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$0.095

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$0.095

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Corphita

USA . 2,115 parts In-Stock

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$0.106

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2,115

$0.106

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Continental Prestige Electronics

USA . 15,000 parts In-Stock

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$0.091

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$0.091

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SupplyDigital Components

Austria . 5,010 parts In-Stock

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Perfect Parts

USA . 3,349 parts In-Stock

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TANS Electronics

Latvia . 3,166 parts In-Stock

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Kulean Microsystems

USA . 2,396 parts In-Stock

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Problanco Electronics

Mexico . 2,298 parts In-Stock

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UHIMA Technologies

Türkiye . 659 parts In-Stock

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Overview

Experience the unbeatable quality of the NLU2G04CMUTCG by Onsemi, a top-of-the-line logic gate designed to exceed your expectations. Onsemi's reputation for excellence guarantees reliability and performance in every product. Ideal for a variety of applications, this logic gate offers unparalleled value with its fast propagation delay, small outline package, and dual terminal position. Trust Onsemi to deliver superior technology that meets your needs and surpasses your standards. Elevate your projects with the NLU2G04CMUTCG and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal processing and minimal signal distortion, making this product efficient for time-critical operations.

Surface Mount: YES

Surface mount capability allows for easy placement and soldering onto circuit boards, enhancing the ease of assembly and reducing overall manufacturing costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used supply voltage of 5V ensures compatibility with a wide range of systems and enables ease of integration.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability and stability in harsh operating conditions, making it suitable for industrial and automotive applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic families, making this product versatile and energy-efficient.

Technical Specifications

Logic Gates NLU2G04CMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Gold/Palladium (Ni/Au/Pd)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU2G04CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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