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NLU2G16MUTCG

Onsemi

NLU2G16MUTCG by Onsemi

NLU2G16MUTCG by Onsemi is a logic gate with 14.5 ns propagation delay, suitable for military applications. It operates at a supply voltage range of 1.65V to 5.5V and has a load capacitance of 50pF, making it ideal for high-speed signal processing in harsh environments. With surface mount capability and compact dimensions (1.2mm x 1mm), this device offers reliable performance in space-constrained designs.

Median Price

$0.262

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 3,000 parts In-Stock

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3,000

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Mouser Electronics

USA . 254 parts In-Stock

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$0.262

254

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$0.262

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.630

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100

$0.630

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Chip Stock

USA . 52,000 parts In-Stock

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52,000

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Vyrian

USA . 7,834 parts In-Stock

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Flip Electronics

USA . 3,867 parts In-Stock

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NAC Semi

USA . 3,000 parts In-Stock

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$0.241

3,000

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$0.241

Digiode

USA . 625 parts In-Stock

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625

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Distributors (Availability)

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Vigor

Singapore . 254 parts In-Stock

1+ parts

$0.220

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$0.220

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Corohmni

South Africa . 209 parts In-Stock

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$0.241

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$0.241

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Ampacity Inc.

Singapore . 1,603 parts In-Stock

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$0.485

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$0.485

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Continental Prestige Electronics

USA . 5,583 parts In-Stock

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$0.630

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$0.617

5,583

$0.630

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$0.617

Argo Parts USA

USA . 3,634 parts In-Stock

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$0.630

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$0.611

3,634

$0.630

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$0.611

Netroflash

USA . 1,000 parts In-Stock

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$0.630

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$0.598

10k+ parts

$0.586

1,000

$0.630

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$0.598

$0.586

Perfect Parts

USA . 77,093 parts In-Stock

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TANS Electronics

Latvia . 7,181 parts In-Stock

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SupplyDigital Components

Austria . 6,361 parts In-Stock

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Kulean Microsystems

USA . 3,613 parts In-Stock

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Problanco Electronics

Mexico . 3,162 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Microchip USA

USA . 2,697 parts In-Stock

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Corphita

USA . 1,895 parts In-Stock

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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Overview

Discover the power of the NLU2G16MUTCG by Onsemi, a high-quality logic gate that offers precision and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is ideal for a wide range of applications. With a fast propagation delay and low power consumption, this logic gate delivers efficient performance. Its compact design and surface mount capability make it easy to integrate into any project. Experience the value and benefits of this top-tier product, designed to meet your needs with excellence. Elevate your projects with the NLU2G16MUTCG from Onsemi.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast response time, making this product suitable for high-speed applications.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly process.

Package Shape: RECTANGULAR

The rectangular shape provides stable mounting and efficient use of board space.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common supply voltage, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ensuring reliability in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Technical Specifications

Logic Gates NLU2G16MUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.05 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU2G16MUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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